US Patent 10566409 Integrated quantized inductor and fabrication method thereof

An integrated, quantized inductor, comprising a plurality of identical inductor sections, is provided for multiple applications on the chip. The inductor section represents one turn and includes two stacked metal layers with identical area and configuration, separated by dielectric layers, winding around the insulated ferromagnetic core, and interconnected by via. Power transformer, having a primary winding and multiple secondary windings comprised of a plurality of identical inductor sections and a shielded common ferromagnetic core ring, placed outside of the active chip area between the seal ring and pad-ring enhanced area. Inside of active chip area, in proximity to the related linear RF components are placed sensitive inductors, balun-transformers, resonator, separately protected by EM guard rings, wherein one node is open, and the second one is tied to the ground. The fabrication is compatible with integrated circuits manufacturing.