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US Patent 10566409 Integrated quantized inductor and fabrication method thereof
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Patent
Date Filed
May 10, 2016
Date of Patent
February 18, 2020
Patent Application Number
15150443
Patent Citations Received
US Patent 12018963 Proximity sensor device and system
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US Patent 11367697 High-density flip chip package for wireless transceivers
US Patent 11923323 High-density flip chip package for wireless transceivers
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US Patent 11469717 Microwave amplifiers tolerant to electrical overstress
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10566409
Patent Primary Examiner
Charlie Y Peng
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