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US Patent 10727219 Techniques for processing devices

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
January 30, 2019
Date of Patent
July 28, 2020
Patent Application Number
16262489
Patent Citations
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US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
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US Patent 10075657 Edgeless large area camera system
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US Patent 10269756 Die processing
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US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
Patent Citations Received
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US Patent 12113056 Stacked dies and methods for forming bonded structures
0
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US Patent 11476213 Bonded structures without intervening adhesive
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US Patent 11538781 Integrated device packages including bonded structures
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US Patent 12068278 Processed stacked dies
0
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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
0
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US Patent 11462419 Microelectronic assemblies
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US Patent 11037919 Techniques for processing devices
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US Patent 11600542 Cavity packages
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US Patent 11056390 Structures and methods for reliable packages
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US Patent 11610846 Protective elements for bonded structures including an obstructive element
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10727219
Patent Primary Examiner
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Brook Kebede

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