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US Patent 10811284 Substrate processing method and apparatus

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
March 22, 2018
Date of Patent
October 20, 2020
Patent Application Number
15933237
Patent Citations
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US Patent 10074542 Substrate processing method and substrate processing apparatus
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US Patent 10105792 SiC substrate separating method
0
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US Patent 10134614 Substrate peripheral portion measuring device, and substrate peripheral portion polishing apparatus
0
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US Patent 10137552 Polishing apparatus
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US Patent 10144103 Polishing apparatus and polishing method
0
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US Patent 10155294 Polishing apparatus and polishing method
0
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US Patent 10166647 Polishing apparatus and polishing method
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US Patent 10245696 Machine for workpiece processing
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US Patent 10249518 Polishing device and polishing method
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US Patent 10307884 Apparatus for controlling a movement of a grinding wheel, semiconductor wafer grinding system and method for forming semiconductor devices
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10811284
Patent Primary Examiner
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David E. Graybill

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