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US Patent 11031285 Diffusion barrier collar for interconnects
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Patent
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Date Filed
September 27, 2018
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Date of Patent
June 8, 2021
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Patent Application Number
16143850
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Patent Citations
US Patent 10075657 Edgeless large area camera system
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US Patent 10269756 Die processing
US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
Patent Citations Received
US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 11476213 Bonded structures without intervening adhesive
US Patent 11515202 3D IC method and device
US Patent 11515279 Low temperature bonded structures
US Patent 11538781 Integrated device packages including bonded structures
US Patent 11552041 Chemical mechanical polishing for hybrid bonding
US Patent 11581257 Semiconductor package
US Patent 12113054 Non-volatile dynamic random access memory
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12125784 Interconnect structures
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•••
Patent Inventor Names
Rajesh Katkar
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Cyprian Emeka Uzoh
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11031285
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Patent Primary Examiner
Thanh Y. Tran
0
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