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US Patent 11069510 Substrate processing apparatus

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Patent abstract

A plasma supply unit includes a first conductive portion, a second conductive portion having at least a part extending to overlap the first conductive portion, and a ground shield located between the first conductive portion and the second conductive portion, and a substrate processing apparatus including the plasma supply unit.

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Patent Inventor Names
Hyun Soo Jang0
Jeong Ho Lee0
Ki Chul Um0
Yong Gyu Han0
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=110695100
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