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US Patent 11417576 Seal for microelectronic assembly

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
November 8, 2019
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Date of Patent
August 16, 2022
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Patent Application Number
16678058
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Patent Citations
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US Patent 10923408 Cavity packages
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US Patent 10784191 Interface structures and methods for forming same
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US Patent 10727219 Techniques for processing devices
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US Patent 10508030 Seal for microelectronic assembly
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US Patent 10446532 Systems and methods for efficient transfer of semiconductor elements
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US Patent 10002844 Bonded structures
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US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
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US Patent 10075657 Edgeless large area camera system
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US Patent 10204893 Stacked dies and methods for forming bonded structures
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US Patent 10269756 Die processing
•••
Patent Citations Received
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US Patent 11670615 Bonded structures
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US Patent 11948847 Bonded structures
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US Patent 11955393 Structures for bonding elements including conductive interface features
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Patent Inventor Names
Shaowu Huang
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Rajesh Katkar
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Liang Wang
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Ilyas Mohammed
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Guilian Gao
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Cyprian Emeka Uzoh
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11417576
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Patent Primary Examiner
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Eduardo A Rodela
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CPC Code
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B81B 7/007
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B81B 7/0077
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H01L 23/02
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H01L 23/04
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H01L 23/08
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H01L 23/10
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H01L 23/12
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H01L 23/145
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H01L 23/13
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B81B 7/0035
0
•••

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