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US Patent 11417576 Seal for microelectronic assembly
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Edits on 10 Apr, 2024
"update inverses"
Golden AI
edited on 10 Apr, 2024
Edits made to:
Infobox
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+1
properties)
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Patent Citations Received
US Patent 11955393 Structures for bonding elements including conductive interface features
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Edits on 4 Apr, 2024
"update inverses"
Golden AI
edited on 4 Apr, 2024
Edits made to:
Infobox
(
+1
properties)
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Patent Citations Received
US Patent 11948847 Bonded structures
0
Edits on 16 Oct, 2023
"Add patent inventor(s)"
Golden AI
edited on 16 Oct, 2023
Edits made to:
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+6
properties)
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Patent Inventor Names
Cyprian Emeka Uzoh
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Guilian Gao
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Ilyas Mohammed
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Liang Wang
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Rajesh Katkar
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Shaowu Huang
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Edits on 7 Jun, 2023
"update inverses"
Golden AI
edited on 7 Jun, 2023
Edits made to:
Infobox
(
+1
properties)
Infobox
Patent Citations Received
US Patent 11670615 Bonded structures
0
Edits on 27 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 27 Apr, 2023
Infobox
Patent Citations
US Patent 11004757 Bonded structures
0
Edits on 25 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 25 Apr, 2023
Infobox
Patent Citations
US Patent 10784191 Interface structures and methods for forming same
0
Edits on 7 Apr, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 7 Apr, 2023
Infobox
Patent Citations
US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
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Edits on 31 Mar, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 31 Mar, 2023
Infobox
Patent Citations
US Patent 10923408 Cavity packages
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Edits on 24 Mar, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 24 Mar, 2023
Infobox
Patent Citations
US Patent 10204893 Stacked dies and methods for forming bonded structures
0
Edits on 23 Mar, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 23 Mar, 2023
Infobox
Patent Citations
US Patent 10727219 Techniques for processing devices
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"update citations for inverse infoboxes"
Golden AI
edited on 22 Mar, 2023
Infobox
Patent Citations
US Patent 10446456 Integrated circuits protected by substrates with cavities, and methods of manufacture
0
Edits on 20 Mar, 2023
"update citations for inverse infoboxes"
Golden AI
edited on 20 Mar, 2023
Infobox
Patent Citations
US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
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Edits on 6 Oct, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 6 Oct, 2022
Infobox
Patent Citations
US Patent 10002844 Bonded structures
0
Edits on 27 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 27 Sep, 2022
Infobox
Patent Citations
US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
0
Edits on 26 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 26 Sep, 2022
Infobox
Patent Citations
US Patent 10784191 Interface structures and methods for forming same
0
"update citations for inverse infoboxes"
Golden AI
edited on 26 Sep, 2022
Infobox
Patent Citations
US Patent 10204893 Stacked dies and methods for forming bonded structures
0
"Entity importer update"
Golden AI
edited on 26 Sep, 2022
Infobox
Is a
Patent
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11417576
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Date of Patent
August 16, 2022
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Patent Application Number
16678058
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Date Filed
November 8, 2019
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Patent Citations
US Patent 11205600 Integrated circuits protected by substrates with cavities, and methods of manufacture
0
US Patent 10002844 Bonded structures
0
US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
0
US Patent 10075657 Edgeless large area camera system
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US Patent 10204893 Stacked dies and methods for forming bonded structures
0
US Patent 10269756 Die processing
0
US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
0
US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
0
US Patent 10446456 Integrated circuits protected by substrates with cavities, and methods of manufacture
0
US Patent 10446487 Interface structures and methods for forming same
0
US Patent 10446532 Systems and methods for efficient transfer of semiconductor elements
0
US Patent 10508030 Seal for microelectronic assembly
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US Patent 10727219 Techniques for processing devices
0
US Patent 10784191 Interface structures and methods for forming same
0
US Patent 10923408 Cavity packages
0
US Patent 11004757 Bonded structures
0
US Patent 11257727 Seal for microelectronic assembly
0
Patent Primary Examiner
Eduardo A Rodela
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CPC Code
H01L 23/12
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H01L 23/145
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H01L 23/13
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H01L 23/02
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H01L 23/10
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H01L 23/08
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H01L 23/04
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B81B 7/0032
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B81B 7/0077
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B81B 7/007
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B81B 7/0058
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B81B 7/0035
0
Edits on 25 Sep, 2022
"update citations for inverse infoboxes"
Golden AI
edited on 25 Sep, 2022
Infobox
Patent Citations
US Patent 10446487 Interface structures and methods for forming same
0
"update citations for inverse infoboxes"
Golden AI
edited on 25 Sep, 2022
Infobox
Patent Citations
US Patent 11004757 Bonded structures
0
"update citations for inverse infoboxes"
Golden AI
edited on 25 Sep, 2022
Infobox
Patent Citations
US Patent 10446532 Systems and methods for efficient transfer of semiconductor elements
0
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