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US Patent 11423966 Memory array staircase structure

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Contents

Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11423966
Patent Inventor Names
Han-Jong Chia0
Feng-Cheng Yang0
Chung-Te Lin0
Yu-Ming Lin0
Sheng-Chen Wang0
Meng-Han Lin0
Date of Patent
August 23, 2022
Patent Application Number
17081380
Date Filed
October 27, 2020
Patent Citations
‌
US Patent 10446437 Interlevel connectors in multilevel circuitry, and method for forming the same
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US Patent 10256248 Through-memory-level via structures between staircase regions in a three-dimensional memory device and method of making thereof
0
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US Patent 10115681 Compact three-dimensional memory device having a seal ring and methods of manufacturing the same
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US Patent 10109639 Lateral non-volatile storage cell
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US Patent 10593399 Self-selecting memory array with horizontal bit lines
0
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US Patent 10930333 Embedded ferroelectric memory cell
0
Patent Citations Received
‌
US Patent 12087621 Air gaps in memory array structures
0
‌
US Patent 11776602 Memory array staircase structure
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US Patent 11985825 3D memory array contact structures
0
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US Patent 11985830 Three-dimensional memory device and method
0
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US Patent 12002534 Memory array word line routing
0
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US Patent 12022659 Three-dimensional memory device and method
0
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US Patent 11716856 Three-dimensional memory device and method
0
Patent Primary Examiner
‌
Fernando Hidalgo
CPC Code
‌
H01L 27/11551
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H01L 27/1159
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H01L 29/6684
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H01L 29/78391
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G11C 8/14
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H01L 21/8221
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H01L 27/1052
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H01L 21/8239
...

Routing arrangements for 3D memory arrays and methods of forming the same are disclosed. In an embodiment, a memory array includes a first word line extending from a first edge of the memory array in a first direction, the first word line having a length less than a length of a second edge of the memory array perpendicular to the first edge of the memory array; a second word line extending from a third edge of the memory array opposite the first edge of the memory array, the second word line extending in the first direction, the second word line having a length less than the length of the second edge of the memory array; a memory film contacting the first word line; and an OS layer contacting a first source line and a first bit line, the memory film being disposed between the OS layer and the first word line.

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