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US Patent 11658119 Backside signal interconnection

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
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Date Filed
March 9, 2021
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Date of Patent
May 23, 2023
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Patent Applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
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Patent Application Number
17196174
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Patent Citations
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US Patent 9105490 Contact structure of semiconductor device
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US Patent 9281254 Methods of forming integrated circuit package
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US Patent 9425126 Dummy structure for chip-on-wafer-on-substrate
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US Patent 9443783 3DIC stacking device and method of manufacture
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US Patent 9576814 Method of spacer patterning to form a target integrated circuit pattern
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US Patent 9704835 Three dimensional integrated circuit
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US Patent 9818872 Multi-gate device and method of fabrication thereof
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US Patent 10020261 Split rail structures located in adjacent metal layers
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US Patent 10032627 Method for forming stacked nanowire transistors
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US Patent 10109721 Horizontal gate-all-around device having wrapped-around source and drain
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•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11658119
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Patent Primary Examiner
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Dao H Nguyen
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CPC Code
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H01L 23/5283
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H01L 21/76838
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H01L 21/823475
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H01L 21/823871
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H01L 23/5286
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H01L 27/0924
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H01L 29/0649
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H01L 29/78
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H01L 29/4175
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H01L 27/088
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•••

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