Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 1, 2023
0Patent Application Number
171869840
Date Filed
February 26, 2021
0Patent Citations
...
Patent Primary Examiner
A package structure and method of manufacturing is provided, whereby a bonding dielectric material layer is provided at a back side of a wafer, a bonding dielectric material layer is provided at a front side of an adjoining wafer, and wherein the bonding dielectric material layers are fusion bonded to each other.
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