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US Patent 11756818 Accommodating device for retaining wafers

Overview Structured Data Issues Contributors Activity

Is a

Date Filed

May 3, 2022

Date of Patent

September 12, 2023

Patent Application Number

17735239

Patent Citations

US Patent 7452793 Wafer curvature estimation, monitoring, and compensation

US Patent 7526858 Apparatus for making electronic devices

US Patent 8454771 Substrate bonding apparatus and substrate bonding method

US Patent 8496466 Press system with interleaved embossing foil holders for nano-imprinting of recording media

US Patent 9299620 Substrate bonding apparatus and substrate bonding method

US Patent 9312161 Accommodating device for retaining wafers

US Patent 10886156 Accomodating device for retaining wafers

US Patent 10325798 Accommodating device for retaining wafers

US Patent 11355374 Accommodating device for retaining wafers

US Patent 7127810 Method of manufacturing electronic device including aligning first substrate, second substrate and mask, and transferring object from first substrate to second substrate, including irradiating object on first substrate with light through mask

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Patent Inventor Names

Alexander Filbert

Thomas Wagenleitner

Markus Wimplinger

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Primary Examiner

CPC Code

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