Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsien-Wei Chen
Sung-Feng Yeh
Ming-Fa Chen
Date of Patent
September 12, 2023
Patent Application Number
17174671
Date Filed
February 12, 2021
Patent Citations
...
Patent Citations Received
Patent Primary Examiner
A package device includes a first device die and second device die bonded thereto. When the area of the second device die is less than half the area of the first device die, one or more inactive structures having a semiconductor substrate is also bonded to the first device die so that the combined area of the second device die and the one or more inactive structures is greater than half the area of the first device die.
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