Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11764171 Integrated circuit structure and method

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
April 27, 2021
Date of Patent
September 19, 2023
Patent Application Number
17241715
Patent Citations
‌
US Patent 9425126 Dummy structure for chip-on-wafer-on-substrate
‌
US Patent 9443783 3DIC stacking device and method of manufacture
‌
US Patent 9461018 Fan-out PoP structure with inconsecutive polymer layer
‌
US Patent 9496189 Stacked semiconductor devices and methods of forming same
‌
US Patent 9666502 Discrete polymer in fan-out packages
‌
US Patent 9735131 Multi-stack package-on-package structures
‌
US Patent 10867879 Integrated circuit package and method
‌
US Patent 8993380 Structure and method for 3D IC package
‌
US Patent 10978392 Electrical chip and optical module
‌
US Patent 9281254 Methods of forming integrated circuit package
•••
Patent Inventor Names
Kuo Lung Pan
Hao-Yi Tsai
Chen-Hua Yu
Tin-Hao Kuo
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11764171
Patent Primary Examiner
‌
Kyoung Lee
CPC Code
‌
H01L 2224/18
‌
H01L 21/4853
‌
H01L 21/4857
‌
H01L 21/565
‌
H01L 21/568
‌
H01L 21/6835
‌
H01L 23/3128
‌
H01L 23/645
‌
H01L 23/5383
‌
H01L 23/5386
•••

Find more entities like US Patent 11764171 Integrated circuit structure and method

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo