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US Patent 11967563 Fan-out package having a main die and a dummy die

Patent 11967563 was granted and assigned to Taiwan Semiconductor Manufacturing Company on April, 2024 by the United States Patent and Trademark Office.

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Patent abstract

A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.

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