Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kuo-Chiang Ting0
Hsien-Pin Hu0
Chen-Hua Yu0
Shang-Yun Hou0
Wen-Chih Chiou0
Weiming Chris Chen0
Date of Patent
May 28, 2024
0Patent Application Number
173397450
Date Filed
June 4, 2021
0Patent Citations
...
Patent Primary Examiner
Patent abstract
Embodiments include packages and methods for forming packages which include interposers having a substrate made of a dielectric material. The interposers may also include a redistribution structure over the substrate which includes metallization patterns which are stitched together in a patterning process which includes multiple lateral overlapping patterning exposures.
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