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US Patent 11996371 Chiplet interposer

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
June 4, 2021
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Date of Patent
May 28, 2024
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Patent Application Number
17339745
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Patent Citations
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US Patent 9372206 Testing of semiconductor chips with microbumps
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US Patent 9425126 Dummy structure for chip-on-wafer-on-substrate
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US Patent 9443783 3DIC stacking device and method of manufacture
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US Patent 9461018 Fan-out PoP structure with inconsecutive polymer layer
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US Patent 9496189 Stacked semiconductor devices and methods of forming same
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US Patent 9666502 Discrete polymer in fan-out packages
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US Patent 10163856 Stacked integrated circuit structure and method of forming
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US Patent 10515888 Semiconductor device and method for manufacturing the same
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US Patent 9735131 Multi-stack package-on-package structures
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US Patent 8993380 Structure and method for 3D IC package
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•••
Patent Inventor Names
Kuo-Chiang Ting
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Hsien-Pin Hu
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Chen-Hua Yu
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Shang-Yun Hou
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Wen-Chih Chiou
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Weiming Chris Chen
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11996371
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Patent Primary Examiner
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Evan G Clinton
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CPC Code
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H01L 2924/18161
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H01L 23/49816
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H01L 23/5384
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H01L 2224/73204
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H01L 23/49838
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H01L 23/3107
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H01L 23/49822
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H01L 23/49827
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H01L 24/02
0
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H01L 24/97
0
•••

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