Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chao-Wen Shih0
Ming-Fa Chen0
Tzuan-Horng Liu0
Sung-Feng Yeh0
Date of Patent
September 17, 2024
0Patent Application Number
175756590
Date Filed
January 14, 2022
0Patent Citations
...
Patent Primary Examiner
CPC Code
Patent abstract
A package structure includes a first die, a die stack structure bonded to the first die, a support structure and an insulation structure. The support structure is disposed on the die stack structure, and a sidewall of the support structure is laterally shifted from a sidewall of the die stack structure. The insulation structure is disposed on the first die and laterally wraps around the die stack structure and the support structure.
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