US Patent 12132247 Semiconductor package and manufacturing method thereof
Patent 12132247 was granted and assigned to Taiwan Semiconductor Manufacturing Company on October, 2024 by the United States Patent and Trademark Office.
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US Patent 12132247 Semiconductor package and manufacturing method thereof
Article
Patent abstract
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes: patch antennas, encapsulated by a first encapsulant; a device die, vertically spaced apart from the patch antennas, and electrically coupled to the patch antennas; and at least one redistribution structure, disposed between the patch antennas and the device die, and including electromagnetic bandgap (EBG) structures laterally surrounding each of the patch antennas.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chun-Lin Lu0
Chung-Yi Hsu0
Han-Ping Pu0
Kai-Chiang Wu0
Yen-Ping Wang0
Date of Patent
October 29, 2024
0Patent Application Number
178742910
Date Filed
July 27, 2022
0Patent Citations
Patent Primary Examiner
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