Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 9142517 Hybrid bonding mechanisms for semiconductor wafers

Patent 9142517 was granted and assigned to Taiwan Semiconductor Manufacturing Company on September, 2015 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity

All edits

Edits on 6 Nov, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 6 Nov, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
0
Edits on 30 Oct, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 30 Oct, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 12132020 Low temperature bonded structures
0
Edits on 24 Oct, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 24 Oct, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 12125784 Interconnect structures
0
Edits on 9 Oct, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 9 Oct, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 12113056 Stacked dies and methods for forming bonded structures
0
"update inverses"
Golden AI profile picture
Golden AI
edited on 9 Oct, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 12113054 Non-volatile dynamic random access memory
0
Edits on 4 Sep, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 4 Sep, 2024
Edits on 29 Aug, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 29 Aug, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 12074092 Hard IP blocks with physically bidirectional passageways
0
Edits on 22 Aug, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 22 Aug, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 12068278 Processed stacked dies
0
Edits on 7 Aug, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 7 Aug, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
0
Edits on 31 Jul, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 31 Jul, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
0
Edits on 24 Jul, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 24 Jul, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
0
"update inverses"
Golden AI profile picture
Golden AI
edited on 24 Jul, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
0
"update inverses"
Golden AI profile picture
Golden AI
edited on 24 Jul, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
0
"update inverses"
Golden AI profile picture
Golden AI
edited on 24 Jul, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
0
Edits on 3 Jul, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 3 Jul, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 12027487 Structures for low temperature bonding using nanoparticles
0
Edits on 12 Jun, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 12 Jun, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 12009338 Dimension compensation control for directly bonded structures
0
Edits on 8 May, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 8 May, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 8 May, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11978724 Diffused bitline replacement in memory
0
Edits on 1 May, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 1 May, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11973056 Methods for low temperature bonding using nanoparticles
0
Edits on 24 Apr, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 24 Apr, 2024

Find more entities like US Patent 9142517 Hybrid bonding mechanisms for semiconductor wafers

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo