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US Patent 9461007 Wafer-to-wafer bonding structure

Patent 9461007 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on October, 2016 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
July 10, 2015
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Date of Patent
October 4, 2016
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Patent Application Number
14796506
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Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 12068278 Processed stacked dies
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US Patent 12074092 Hard IP blocks with physically bidirectional passageways
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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12113054 Non-volatile dynamic random access memory
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US Patent 12125784 Interconnect structures
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US Patent 12132020 Low temperature bonded structures
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US Patent 11664357 Techniques for joining dissimilar materials in microelectronics
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US Patent 11670615 Bonded structures
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•••
Patent Inventor Names
Ju-il Choi
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Pil-kyu Kang
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Byung-lyul Park
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Jae-hwa Park
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Jin-ho Chun
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9461007
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Patent Primary Examiner
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Alexander Oscar Williams
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