US Patent 9653433 Multi-chip structure and method of forming same

A device comprises a first chip and a second chip stacked together to form a multi-chip structure, wherein the multi-chip structure is embedded in an encapsulation layer, and wherein at least one edge of the first chip and the second chip is exposed outside the encapsulation layer, a redistribution layer on a surface of a first side of the encapsulation layer and a plurality of conductive bumps over the redistribution layer and connected to the redistribution layer.