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US Patent 9653433 Multi-chip structure and method of forming same

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
March 30, 2016
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Date of Patent
May 16, 2017
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Patent Application Number
15085837
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Patent Citations Received
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US Patent 11764189 Molded direct bonded and interconnected stack
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US Patent 11769718 Packages with Si-substrate-free interposer and method forming same
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US Patent 12075734 Volumetric budget based irrigation control
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US Patent 11837582 Molded direct bonded and interconnected stack
0
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US Patent 11916054 Stacked devices and methods of fabrication
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US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics
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US Patent 12068278 Processed stacked dies
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US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12113005 Packages with Si-substrate-free interposer and method forming same
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Patent Inventor Names
Der-Chyang Yeh
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Chen-Hua Yu
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
9653433
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Patent Primary Examiner
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William Coleman
0

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