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US Patent 9656852 CMOS-MEMS device structure, bonding mesa structure and associated method

Patent 9656852 was granted and assigned to Taiwan Semiconductor Manufacturing Company on May, 2017 by the United States Patent and Trademark Office.

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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 12132020 Low temperature bonded structures
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US Patent 12125784 Interconnect structures
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12113054 Non-volatile dynamic random access memory
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US Patent 12074092 Hard IP blocks with physically bidirectional passageways
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US Patent 12068278 Processed stacked dies
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US Patent 12027487 Structures for low temperature bonding using nanoparticles
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US Patent 12009338 Dimension compensation control for directly bonded structures
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US Patent 11978724 Diffused bitline replacement in memory
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US Patent 11973056 Methods for low temperature bonding using nanoparticles
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Edits on 24 Apr, 2024
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