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US Patent D1042731 Gas nozzle for semiconductor manufacturing equipment

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
November 28, 2022
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Date of Patent
September 17, 2024
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Patent Application Number
29861210
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Patent Citations
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US Patent D888196 Gas nozzle for substrate processing apparatus
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US Patent D889596 Gas nozzle for substrate processing apparatus
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US Patent D890572 Gas supply nozzle for substrate processing apparatus
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US Patent 10960415 Spray nozzle and method
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US Patent D937385 Return nozzle
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US Patent D965740 Gas supply nozzle for substrate processing apparatus
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US Patent D1020668 Gas injector for substrate processing apparatus
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US Patent D783351 Gas nozzle substrate processing apparatus
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US Patent D828091 Gas supply nozzle
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US Patent D847301 Return nozzle
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•••
Patent Inventor Names
Atsushi Hirano
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
D1042731
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Patent Primary Examiner
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Elizabeth J Oswecki
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CPC Code
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F23D 14/48
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F23D 14/50
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F23D 14/54
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F23D 14/56
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F23D 14/58
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F23D 14/60
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F23D 14/52
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B24B 9/007
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B24B 9/00
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B08B 9/00
0
•••

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