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Ajay K Arora

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Edits on 15 Dec, 2021
"Remove inverse infobox"
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Golden AI
edited on 15 Dec, 2021
Edits made to:
Infobox (-44 properties)
Infobox
Patent primary examiner of
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US Patent 7812439 Semiconductor package with reduced length interconnect and manufacturing method thereof
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US Patent 7816274 Methods for normalizing strain in a semiconductor device
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US Patent 7829371 Image sensor and method for manufacturing the same
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US Patent 7833910 Film substrate, fabrication method thereof, and image display substrate
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US Patent 7834354 Pixel structure and method for manufacturing the same
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US Patent 7843064 Structure and process for the formation of TSVs
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US Patent 7859091 Manufacturing methods for semiconductor device with sealed cap
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US Patent 7868379 Electronic device including a trench and a conductive structure therein
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US Patent 7868406 Photodiode being monolithically integrated onto a waveguide
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US Patent 7883917 Semiconductor device with bonding pad
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US Patent 7884459 Semiconductor device suitable for a stacked structure
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US Patent 7897500 Methods for forming silicide conductors using substrate masking
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US Patent 7901960 Group III nitride substrate, epitaxial layer-provided substrate, methods of manufacturing the same, and method of manufacturing semiconductor device
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US Patent 7901992 Die bonding agent and a semiconductor device made by using the same
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US Patent 7902017 Process of forming an electronic device including a trench and a conductive structure therein
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US Patent 7902034 Method of manufacturing SOI substrate and method of manufacturing semiconductor device
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US Patent 7902069 Small area, robust silicon via structure and process
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US Patent 7902089 N-type transistor, production methods for n-type transistor and n-type transistor-use channel, and production method of nanotube structure exhibiting n-type semiconductor-like characteristics
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US Patent 7902645 Semiconductor device, semiconductor element, and substrate
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US Patent 7902646 Multiphase synchronous buck converter
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US Patent 7902647 TAB package connecting host device element
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US Patent 7906815 Increased reliability for a contact structure to connect an active region with a polysilicon line
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US Patent 7910403 Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same
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US Patent 7915097 Electronic module with conductivity transformation region, method of manufacture and applications thereof
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US Patent 7915728 Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof
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US Patent 7919767 Semiconductor memory device and fabrication method thereof
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US Patent 7923737 Three-terminal switch array device, combined semiconductor device, and image forming apparatus
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US Patent 7928442 Optical device having strained buried channel
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US Patent 7928509 Integrated JFET and schottky diode
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US Patent 7928589 Semiconductor device
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US Patent 7932560 Method of fabricating a semiconductor on insulator device having a frontside substrate contact
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US Patent 7939948 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
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US Patent 7952143 Semiconductor device having IGBT and diode
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US Patent 7952189 Hermetic packaging and method of manufacture and use therefore
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US Patent 7969019 Module with stacked semiconductor devices
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US Patent 7977162 Semiconductor device, method for the same, and heat radiator
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US Patent 7986043 Integrated circuit package on package system
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US Patent 7986049 Semiconductor device having multiple-layer hard mask with opposite stresses and method for fabricating the same
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US Patent 7993975 Method of manufacturing semiconductor device including mounting and dicing chips
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US Patent 7994064 Selective etch for damage at exfoliated surface
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US Patent 7999368 Semiconductor package having ink-jet type dam and method of manufacturing the same
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US Patent 8008154 Methods of forming impurity containing insulating films and flash memory devices including the same
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US Patent 8008205 Methods for producing a semiconductor device having planarization films
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US Patent 8008650 Transistor with nanotube structure exhibiting N-type semiconductor-like characteristics
Edits on 8 Dec, 2021
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 8008650 Transistor with nanotube structure exhibiting N-type semiconductor-like characteristics
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 8008205 Methods for producing a semiconductor device having planarization films
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Golden AI
edited on 8 Dec, 2021
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7999368 Semiconductor package having ink-jet type dam and method of manufacturing the same
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7994064 Selective etch for damage at exfoliated surface
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7993975 Method of manufacturing semiconductor device including mounting and dicing chips
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7986043 Integrated circuit package on package system
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7977162 Semiconductor device, method for the same, and heat radiator
Edits on 8 Dec, 2021
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7969019 Module with stacked semiconductor devices
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7952189 Hermetic packaging and method of manufacture and use therefore
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7952143 Semiconductor device having IGBT and diode
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7939948 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7928589 Semiconductor device
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7928509 Integrated JFET and schottky diode
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7928442 Optical device having strained buried channel
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Golden AI profile picture
Golden AI
edited on 7 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7919767 Semiconductor memory device and fabrication method thereof

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