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US Patent 10840205 Chemical mechanical polishing for hybrid bonding

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
September 17, 2018
Date of Patent
November 17, 2020
Patent Application Number
16133299
Patent Citations
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US Patent 10002844 Bonded structures
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US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
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US Patent 10075657 Edgeless large area camera system
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US Patent 10103122 Hybrid bonding systems and methods for semiconductor wafers
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US Patent 10147641 3D IC method and device
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US Patent 10204893 Stacked dies and methods for forming bonded structures
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US Patent 10211166 Semiconductor device and method of manufacturing the same
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US Patent 10269708 Increased contact alignment tolerance for direct bonding
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US Patent 10269756 Die processing
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US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
•••
Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
0
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US Patent 11552041 Chemical mechanical polishing for hybrid bonding
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US Patent 12125784 Interconnect structures
0
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US Patent 12132020 Low temperature bonded structures
0
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US Patent 11515279 Low temperature bonded structures
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US Patent 11244920 Method and structures for low temperature device bonding
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US Patent 11011494 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
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US Patent 11600542 Cavity packages
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US Patent 11610846 Protective elements for bonded structures including an obstructive element
0
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US Patent 11621246 Diffused bitline replacement in stacked wafer memory
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10840205
Patent Primary Examiner
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Stephen W Smoot

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