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US Patent 11004757 Bonded structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
December 28, 2018
Date of Patent
May 11, 2021
Patent Application Number
16235585
Patent Citations
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US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
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US Patent 10075657 Edgeless large area camera system
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US Patent 10204893 Stacked dies and methods for forming bonded structures
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US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
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US Patent 10269756 Die processing
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US Patent 10446456 Integrated circuits protected by substrates with cavities, and methods of manufacture
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US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
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US Patent 10002844 Bonded structures
Patent Citations Received
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US Patent 12132020 Low temperature bonded structures
0
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US Patent 12113054 Non-volatile dynamic random access memory
0
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US Patent 12113056 Stacked dies and methods for forming bonded structures
0
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US Patent 11515279 Low temperature bonded structures
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US Patent 11600542 Cavity packages
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US Patent 11056432 Semiconductor package
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US Patent 11621246 Diffused bitline replacement in stacked wafer memory
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US Patent 11257727 Seal for microelectronic assembly
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US Patent 11670615 Bonded structures
0
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US Patent 11694925 Diffusion barrier collar for interconnects
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11004757
Patent Primary Examiner
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Laura M Menz

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