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US Patent 11385278 Security circuitry for bonded structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
May 22, 2020
Date of Patent
July 12, 2022
Patent Application Number
16881621
Patent Citations
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US Patent 11205625 Wafer-level bonding of obstructive elements
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US Patent 10923408 Cavity packages
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US Patent 10002844 Bonded structures
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US Patent 10014429 Semiconductor structures including bonding layers, multi-junction photovoltaic cells and related methods
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US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
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US Patent 10026716 3DIC formation with dies bonded to formed RDLs
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US Patent 10075657 Edgeless large area camera system
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US Patent 10204893 Stacked dies and methods for forming bonded structures
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US Patent 10269708 Increased contact alignment tolerance for direct bonding
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US Patent 10269756 Die processing
•••
Patent Citations Received
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US Patent 12125784 Interconnect structures
0
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US Patent 11694925 Diffusion barrier collar for interconnects
0
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US Patent 11756880 Interconnect structures
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US Patent 11790219 Three dimensional circuit implementing machine trained network
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US Patent 11978724 Diffused bitline replacement in memory
0
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US Patent 12068278 Processed stacked dies
0
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US Patent 12074092 Hard IP blocks with physically bidirectional passageways
0
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US Patent 12113054 Non-volatile dynamic random access memory
0
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US Patent 12113056 Stacked dies and methods for forming bonded structures
0
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US Patent 11621246 Diffused bitline replacement in stacked wafer memory
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11385278
Patent Primary Examiner
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Nathan W Ha
CPC Code
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H01L 24/80
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H01L 23/53238
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H01L 23/5384
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G01R 31/2853
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G01R 31/70
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H01L 24/10

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