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US Patent 12068167 Self-aligned double patterning
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Patent
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Date Filed
May 12, 2023
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Date of Patent
August 20, 2024
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Patent Application Number
18316620
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Patent Citations
US Patent 8822243 Light emitting devices having light coupling layers with recessed electrodes
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US Patent 8987142 Multi-patterning method and device formed by the method
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US Patent 9053279 Pattern modification with a preferred position function
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US Patent 9093530 Fin structure of FinFET
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US Patent 9099530 Methods of patterning small via pitch dimensions
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US Patent 9153478 Spacer etching process for integrated circuit design
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US Patent 9455194 Method for fabricating semiconductor device
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US Patent 9501601 Layout optimization of a main pattern and a cut pattern
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US Patent 9548303 FinFET devices with unique fin shape and the fabrication thereof
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US Patent 10559492 Patterning methods for semiconductor devices and structures resulting therefrom
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Patent Inventor Names
Yu-Yu Chen
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Kuan-Wei Huang
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Jyu-Horng Shieh
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
12068167
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Patent Primary Examiner
Robert G Bachner
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CPC Code
H01L 21/76898
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H01L 21/0337
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H01L 21/76811
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H01L 21/76816
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H01L 2221/101
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H01L 21/0338
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H01L 21/31144
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H01L 21/3081
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H01L 21/3086
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H01L 21/32139
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•••
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