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Cathy F. Lam

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Edits on 14 Dec, 2021
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edited on 14 Dec, 2021
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Infobox (-91 properties)
Infobox
Patent primary examiner of
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US Patent 7087267 Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization
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US Patent 7101619 Laminate
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US Patent 7105221 Circuit board, laminated member for circuit board, and method for making laminated member for circuit board
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US Patent 7108914 Self-healing polymer compositions
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US Patent 7122243 Metal/ceramic bonding substrate and method for producing same
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US Patent 7128979 Circuit board, method of producing same, and power module
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US Patent 7132029 Multilayer circuit board and method for manufacturing the same
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US Patent 7144618 Multilayer composite and method for preparing the same
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US Patent 7144833 Dielectric ceramic composition and laminated ceramic device using the same
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US Patent 7154736 Ceramic multi-layer element and a method for the production thereof
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US Patent 7156669 Anisotropic conductive film
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US Patent 7160628 Opaque chrome coating having increased resistance to pinhole formation
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US Patent 7161117 Window glass for vehicles equipped with a conductor and its production process
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US Patent 7172805 Method for manufacturing a sequential backplane
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US Patent 7172806 Monolithic ceramic electronic component
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US Patent 7175920 Copper foil for high-density ultra-fine printed wiring board
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US Patent 7177519 Functional multilayer film and method for manufacturing the same
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US Patent 7179519 Polyimide/metal laminate, and electric/electronic equipment bases, magnetic recording bases, solar battery bases, coating film for aerospace materials and filmy resistance elements with the use thereof
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US Patent 7179520 Circuit substrate, electro-optic device and electronic equipment
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US Patent 7180006 Tape substrate and method for fabricating the same
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US Patent 7182996 Deposting nanowires on a substrate
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US Patent 7189449 Metal/ceramic bonding substrate and method for producing same
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US Patent 7192654 Multilayered construction for resistor and capacitor formation
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US Patent 7199456 Injection moulded product and a method for its manufacture
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US Patent 7205482 Tape carrier for TAB
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US Patent 7208218 Method of suppressing the oxidation characteristics of nickel
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US Patent 7214419 Conductive paste multilayered board including the conductive paste and process for producing the same
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US Patent 7223481 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board
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US Patent 7226653 Printed circuit board and method for producing a printed circuit board
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US Patent 7226654 Laminated wiring board and its mounting structure
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US Patent 7239027 Bonding structure of device packaging
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US Patent 7241510 Peelable circuit board foil
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US Patent 7243951 Durable security devices and security articles employing such devices
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US Patent 7250840 Layered product
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US Patent 7252891 Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
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US Patent 7255919 Mold release layer transferring film and laminate film
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US Patent 7261841 Thick film conductor case compositions for LTCC tape
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US Patent 7264482 Anisotropic conductive sheet
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US Patent 7265298 Serpentine and corduroy circuits to enhance the stretchability of a stretchable electronic device
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US Patent 7265803 Reconfigurable logic through deposition of organic pathways
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US Patent 7267713 Conductive paste and glass circuit structure
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US Patent 7279217 Multilayer ceramic device, method for manufacturing the same, and ceramic device
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US Patent 7285316 Process to manufacture three dimensionally shaped substrate for sound abatement
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US Patent 7285321 Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto
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US Patent 7288287 Circuit formation part and manufacturing method for this circuit formation part
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US Patent 7288843 Integrated circuit chip support substrate for placing in a mold, and associated method
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US Patent 7289183 Copper conducting wire structure and fabricating method thereof
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US Patent 7291380 Laser enhanced plating for forming wiring patterns
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US Patent 7294389 Microstructure array and a microlens array
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US Patent 7294390 Method for improving the thermal cycled adhesion of thick-film conductors on dielectric
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US Patent 7294393 Sheet material and wiring board
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US Patent 7294919 Device having a complaint element pressed between substrates
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US Patent 7295421 Multilayer ceramic electronic components and method for manufacturing the same
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US Patent 7297423 Printed circuit board
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US Patent 7301097 Printed-circuit board and electronic device
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US Patent 7301228 Semiconductor device, method for manufacturing same and thin plate interconnect line member
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US Patent 7303639 Method for producing Z-axis interconnection assembly of printed wiring board elements
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US Patent 7303698 Thick film conductor case compositions for LTCC tape
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US Patent 7306860 Protective coating for oxide ceramic based composites
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US Patent 7312534 Interlayer dielectric and pre-applied die attach adhesive materials
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US Patent 7317258 Thermal interface apparatus, systems, and fabrication methods
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US Patent 7323238 Printed circuit board having colored outer layer
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US Patent 7323245 Electric connecting part
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US Patent 7323255 Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate
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US Patent 7324324 Multilayer electronic component and manufacturing method thereof
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US Patent 7326460 Device, method of manufacturing the same, electro-optic device, and electronic equipment
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US Patent 7326463 Conductive circuits or cables manufactured from conductive loaded resin-based materials
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US Patent 7329458 Wiring member and method of manufacturing the same
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US Patent 7329817 Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet
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US Patent 7332212 Circuitized substrate with conductive polymer and seed material adhesion layer
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US Patent 7332229 Varnish, shaped item, electrical insulating film, laminate, flame retardant slurry and process for producing flame retardant particles and varnish
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US Patent 7332231 Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same
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US Patent 7335414 Printed circuit board and camera module
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US Patent 7338716 Laminate and process for producing the same
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US Patent 7344785 Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same
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US Patent 7348045 Controlled depth etched dielectric film
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US Patent 7348069 Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate
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US Patent 7351676 Dielectric porcelain composition, multilayer ceramic capacitor, and electronic component
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US Patent 7371471 Electromagnetic noise suppressing thin film
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US Patent 7371475 Target for transparent conductive thin film, transparent conductive thin film and manufacturing method thereof, electrode material for display, organic electroluminescence element and solar cell
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US Patent 7374811 Probe pad structure in a ceramic space transformer
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US Patent 7384683 Substrate for flexible printed wiring board and method for manufacturing the same
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US Patent 7388296 Wiring substrate and bonding pad composition
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US Patent 7393580 Layered board and electronic apparatus having the layered board
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US Patent 7396591 Wiring substrate
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US Patent RE40436 Hermetic seal and method to create the same
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US Patent 7423220 Conductive paste for multilayer electronic components and multilayer electronic component using same
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US Patent 7440256 Laminated ceramic substrate and manufacturing method therefor
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US Patent 7455915 Selective application of conductive material to substrates by pick and place of compliant contact arrays
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US Patent 7459044 Sheet material especially useful for circuit boards
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US Patent 7524552 Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer
Edits on 2 Dec, 2021
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edited on 2 Dec, 2021
Edits on 1 Dec, 2021
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Golden AI
edited on 1 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
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US Patent 7459044 Sheet material especially useful for circuit boards
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Golden AI
edited on 1 Dec, 2021
Golden AI profile picture
Golden AI
edited on 1 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
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US Patent 7440256 Laminated ceramic substrate and manufacturing method therefor
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Golden AI
edited on 1 Dec, 2021
Edits on 30 Nov, 2021
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Golden AI
edited on 30 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent RE40436 Hermetic seal and method to create the same
Golden AI profile picture
Golden AI
edited on 30 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7396591 Wiring substrate
Golden AI profile picture
Golden AI
edited on 30 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7393580 Layered board and electronic apparatus having the layered board
Golden AI profile picture
Golden AI
edited on 30 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7388296 Wiring substrate and bonding pad composition
Golden AI profile picture
Golden AI
edited on 30 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7384683 Substrate for flexible printed wiring board and method for manufacturing the same
Edits on 29 Nov, 2021
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Golden AI
edited on 29 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7374811 Probe pad structure in a ceramic space transformer
Edits on 26 Nov, 2021
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Golden AI
edited on 26 Nov, 2021
Golden AI profile picture
Golden AI
edited on 26 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7371471 Electromagnetic noise suppressing thin film
Edits on 24 Nov, 2021
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Golden AI
edited on 24 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7351676 Dielectric porcelain composition, multilayer ceramic capacitor, and electronic component
Edits on 24 Nov, 2021
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Golden AI
edited on 24 Nov, 2021
Golden AI profile picture
Golden AI
edited on 24 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7348045 Controlled depth etched dielectric film
Golden AI profile picture
Golden AI
edited on 24 Nov, 2021
Edits on 23 Nov, 2021
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Golden AI
edited on 23 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7338716 Laminate and process for producing the same
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Golden AI
edited on 23 Nov, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7335414 Printed circuit board and camera module

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