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US Patent 10020254 Integration of super via structure in BEOL

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
October 9, 2017
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Date of Patent
July 10, 2018
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Patent Application Number
15727956
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Patent Citations Received
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US Patent 12113013 Dual color via patterning
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US Patent 11056426 Metallization interconnect structure formation
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US Patent 11075161 Large via buffer
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US Patent 11646264 Semiconductor structure with super via and manufacturing method thereof
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US Patent 11270936 Integrated circuit including supervia and method of making
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US Patent 11784120 Metal via structure
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US Patent 11430735 Barrier removal for conductor in top via integration scheme
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US Patent 11908791 Partial subtractive supervia enabling hyper-scaling
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US Patent 11916013 Via interconnects including super vias
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US Patent 12113014 Integrated circuit including supervia and method of making
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•••
Patent Inventor Names
Joe Lee
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Ruqiang Bao
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Yann Mignot
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Yongan Xu
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Junli Wang
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Hosadurga Shobha
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10020254
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Patent Primary Examiner
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Errol Fernandes
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