Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11670601 Stacking via structures for stress reduction

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
December 18, 2020
0
Date of Patent
June 6, 2023
0
Patent Application Number
17126957
0
Patent Citations
‌
US Patent 8778738 Packaged semiconductor devices and packaging devices and methods
0
‌
US Patent 8829676 Interconnect structure for wafer level package
0
‌
US Patent 9000584 Packaged semiconductor device with a molding compound and a method of forming the same
0
‌
US Patent 9048222 Method of fabricating interconnect structure for package-on-package devices
0
‌
US Patent 9048233 Package systems having interposers
0
‌
US Patent 9064879 Packaging methods and structures using a die attach film
0
‌
US Patent 9111949 Methods and apparatus of wafer level package for heterogeneous integration technology
0
‌
US Patent 9263511 Package with metal-insulator-metal capacitor and method of manufacturing the same
0
‌
US Patent 9281254 Methods of forming integrated circuit package
0
‌
US Patent 9372206 Testing of semiconductor chips with microbumps
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11670601
0
Patent Primary Examiner
‌
Selim U Ahmed
0
CPC Code
‌
H01L 21/76895
0
‌
H01L 2224/8385
0
‌
H01L 23/562
0
‌
H01L 21/4853
0
‌
H01L 21/4857
0
‌
H01L 21/563
0
‌
H01L 23/3185
0
‌
H01L 23/5383
0
‌
H01L 23/5386
0
‌
H01L 24/16
0
•••

Find more entities like US Patent 11670601 Stacking via structures for stress reduction

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo