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US Patent 11703639 Photonic semiconductor device and method

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
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Date Filed
January 3, 2022
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Date of Patent
July 18, 2023
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Patent Application Number
17567349
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Patent Citations
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US Patent 9048222 Method of fabricating interconnect structure for package-on-package devices
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US Patent 9048233 Package systems having interposers
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US Patent 9064879 Packaging methods and structures using a die attach film
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US Patent 9111949 Methods and apparatus of wafer level package for heterogeneous integration technology
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US Patent 9263511 Package with metal-insulator-metal capacitor and method of manufacturing the same
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US Patent 9281254 Methods of forming integrated circuit package
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US Patent 9299649 3D packages and methods for forming the same
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US Patent 9368460 Fan-out interconnect structure and method for forming same
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US Patent 9372206 Testing of semiconductor chips with microbumps
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US Patent 9425126 Dummy structure for chip-on-wafer-on-substrate
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•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11703639
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Patent Primary Examiner
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Jerry Rahll
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