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Cathy Lam

based in Canada

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Edits on 24 Sep, 2022
"Infobox creation from: https://twitter.com/c4thylam"
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Golden AI
edited on 24 Sep, 2022
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Location
Quebec City
Quebec City
"Edit from table cell"
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Georgii Nesterov
edited on 24 Sep, 2022
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Twitter URL
https://twitter.com/c4thylam
Edits on 14 Dec, 2021
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Golden AI
edited on 14 Dec, 2021
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Patent primary examiner of
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US Patent 7087293 Thick film dielectric compositions for use on aluminum nitride substrates
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US Patent 7229693 Low defect density, ideal oxygen precipitating silicon
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US Patent 7249837 Printing on flocked paper and films
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US Patent 7270398 Circuit board and liquid discharging apparatus
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US Patent 7273664 Preparation method of a coating of gallium nitride
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US Patent 7323237 Algae-resistant roofing material and methods
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US Patent 7390974 Multilayer printed wiring board with filled viahole structure
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US Patent 7423344 Bi-layer etch stop process for defect reduction and via stress migration improvement
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US Patent 7429063 Counterfeit-proof metallic foil
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US Patent 7435468 Multi-layer structure and method of drawing microscopic structure therein, optical disc master and method of fabricating the same using the multi-layer structure, and optical disc manufactured using the optical disc master
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US Patent 7438969 Filling material, multilayer wiring board, and process of producing multilayer wiring board
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US Patent 7439625 Circuit board
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US Patent 7446421 Bonding structure with buffer layer and method of forming the same
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US Patent 7452612 Wiring substrate
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US Patent 7453702 Printed wiring board
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US Patent 7459200 Circuit board design
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US Patent 7459202 Printed circuit board
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US Patent 7470461 Printed circuit board and method of manufacturing the same
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US Patent 7473458 Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
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US Patent 7473459 Method of manufacturing a film printed circuit board
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US Patent 7473460 Ceramic substrate, electronic apparatus, and method for producing ceramic substrate
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US Patent 7473854 Printed circuit board
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US Patent 7479590 Dry adhesives, methods of manufacture thereof and articles comprising the same
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US Patent 7479687 Deep via seed repair using electroless plating chemistry
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US Patent 7482052 Method for processing by laser, apparatus for processing by laser, and three-dimensional structure
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US Patent 7485361 Multilayered printed wiring board and manufacturing method thereof
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US Patent 7491895 Wiring substrate and method of fabricating the same
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US Patent 7492326 Biodegradable radio frequency identification cards
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US Patent 7498074 Metal photoetching product and production method thereof
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US Patent 7504148 Printed circuit board structure and manufacturing method thereof
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US Patent 7507682 Method of manufacturing ceramic paste and ceramic multi-layer wiring substrate utilizing the same
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US Patent 7510759 Electronic part and manufacturing method thereof
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US Patent 7531204 Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto
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US Patent 7535715 Conformable interface materials for improving thermal contacts
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US Patent 7538440 Method for improved high current component interconnections
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US Patent 7547479 Tin-coated printed circuit boards with low tendency to whisker formation
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US Patent 7547849 Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto
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US Patent 7550825 Interlayer dielectric and pre-applied die attach adhesive materials
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US Patent 7556850 Wiring circuit board
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US Patent 7557302 Printed circuit board with electrostatic discharge damage prevention
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US Patent 7558047 Electronic component and method for producing the same
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US Patent 7572500 Method of manufacturing circuit-forming board and material of circuit-forming board
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US Patent 7572503 Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same
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US Patent 7586047 Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component
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US Patent 7595997 Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component
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US Patent 7601419 Printed circuit board and method of manufacturing the same
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US Patent RE40947 Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
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US Patent 7608929 Electrical connector structure of circuit board and method for fabricating the same
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US Patent 7615277 Formation method of metal layer on resin layer, printed wiring board, and production method thereof
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US Patent 7615705 Enhanced-reliability printed circuit board for tight-pitch components
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US Patent 7622183 Multilayer printed wiring board with filled viahole structure
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US Patent 7622806 Laser mark on an IC component
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US Patent 7626128 Conductive film
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US Patent 7629045 Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
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US Patent 7635815 Lightweight circuit board with conductive constraining cores
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US Patent 7638873 Wired circuit board
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US Patent 7642466 Connection configuration for rigid substrates
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US Patent 7655292 Electrically conductive substrate with high heat conductivity
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US Patent 7655871 Resin composition, resin-attached metal foil, base material-attached insulating sheet and multiple-layered printed wiring board
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US Patent 7658988 Printed circuits prepared from filled epoxy compositions
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US Patent 7667142 Lightweight circuit board with conductive constraining cores
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US Patent 7670672 Multilayer ceramic substrate and method for producing same
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US Patent 7674984 Wiring board
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US Patent 7681991 Composite ceramic substrate for micro-fluid ejection head
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US Patent 7687137 Insulating substrate and manufacturing method therefor, and multilayer wiring board and manufacturing method therefor
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US Patent 7691458 Carrier substrate with a thermochromatic coating
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US Patent 7691469 Ceramic multilayer substrate and method for manufacturing the same
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US Patent 7705471 Conductive bump structure of circuit board and method for forming the same
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US Patent 7718273 Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof
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US Patent 7722950 Adhesive compositions for flexible circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
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US Patent 7723855 Pad and circuit board, electronic device using same
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US Patent 7728232 Printed circuit board assembly having adhesive layer
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US Patent 7728233 Connection structure of flexible substrate
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US Patent 7728441 Method for mounting a semiconductor package onto PCB
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US Patent 7737368 Circuit board and method of manufacturing circuit board
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US Patent 7738261 Functional device fabrication apparatus and functional device fabricated with the same
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US Patent 7740936 Adhesion assisting agent fitted metal foil, and printed wiring board using thereof
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US Patent 7744996 Adhesive structure and method for manufacturing the same
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US Patent 7745726 Assembly structure
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US Patent 7749592 Multilayer ceramic substrate
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US Patent 7749605 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
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US Patent 7749608 Molded polymer comprising silicone and at least one metal trace
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US Patent 7749611 Peel strength enhancement of copper laminates
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US Patent 7749612 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
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US Patent 7750250 Blind via capture pad structure
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US Patent 7750456 Printed circuit board and method of manufacturing semiconductor package using the same
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US Patent 7754321 Method of manufacturing clad board for forming circuitry, clad board and core board for clad board
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US Patent 7755200 Methods and arrangements for forming solder joint connections
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US Patent 7759583 Circuit board
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US Patent 7764484 Multilayer electronic component and method for manufacturing the same
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US Patent 7771841 Ultrathin copper foil with carrier and printed circuit board using same
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US Patent 7776426 Ceramic circuit substrate and manufacturing method thereof
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US Patent 7776438 Adhesive film for circuit connection, and circuit connection structure
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US Patent 7785708 Adhesive film for circuit connection, and circuit connection structure
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US Patent 7790268 Circuit materials, multilayer circuits, and methods of manufacture thereof
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US Patent 7790271 Dielectric ceramic composition, ceramic substrate, and method for producing the same
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US Patent 7794578 Method for preparing a circuit board material having a conductive base and a resistance layer
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US Patent 7794820 Printed circuit board and fabricating method of the same
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US Patent 7799409 Ceramic green sheet structure and method for manufacturing laminated ceramic electronic component
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US Patent 7804677 Electronic component and method for producing the same
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US Patent 7813104 Ceramic element
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US Patent 7820274 Prepreg and conductive layer-laminated substrate for printed wiring board
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US Patent 7829794 Partially rigid flexible circuits and method of making same
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US Patent 7829996 Film structure and electronic device housing utilizing the same
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US Patent 7846317 Processing a printed wiring board by single bath electrodeposition
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US Patent 7857997 Conductive ink formulations
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US Patent 7862860 Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization
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US Patent 7862889 Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
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US Patent 7875340 Heat radiation substrate having metal core and method of manufacturing the same
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US Patent 7879438 Substrate warpage-reducing structure
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US Patent 7880092 Multilayer ceramic electronic component
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US Patent 7887905 Constraining green sheet and manufacturing method of multi-layer ceramic substrate using the same
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US Patent 7888602 Printed circuit board having air vent for molding and package using the same
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US Patent 7888604 Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method
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US Patent 7892655 Ultrathin copper foil with carrier and printed circuit board using same
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US Patent 7901761 Hermetic vias utilizing metal-metal oxides
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US Patent 7906200 Composite circuit substrate structure
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US Patent 7910214 Molded ferrite sheet, sintered ferrite substrate and antenna module
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US Patent 7911801 Multilayer ceramic substrate and method for manufacturing the same
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US Patent 7915527 Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings
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US Patent 7931518 Process for preparing light transmissive electromagnetic wave shielding material, light transmissive electromagnetic wave shielding material and display filter
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US Patent 7931973 Manufacturing method of metal structure in multi-layer substrate and structure thereof
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US Patent 7937835 Composite ceramic substrate for micro-fluid ejection head
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US Patent 7947332 Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board
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US Patent 7947344 Artificial fruit apparatus
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US Patent 7955689 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof
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US Patent 7956472 Packaging substrate having electrical connection structure and method for fabricating the same
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US Patent 7957119 Metal films, methods for production thereof, methods for production of laminated electronic components, and laminated electronic components
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US Patent 7964289 Formation method of metal layer on resin layer, printed wiring board, and production method thereof
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US Patent 7964801 Circuit board structure and fabrication method thereof
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US Patent 7968187 Surface coating
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US Patent 7968804 Methods of patterning a deposit metal on a substrate
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US Patent 7973238 Ceramic compact, ceramic part, method for producing ceramic compact, and method for producing ceramic part
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US Patent 7976940 Component, method for coating a component, and powder
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US Patent 7976956 Laminated circuit board
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US Patent 7981508 Flexible circuits
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US Patent 7982322 Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same
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US Patent 7985488 Ultrathin copper foil with carrier and printed circuit board using same
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US Patent 7989080 Method and apparatus for providing hermetic electrical feedthrough
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US Patent 7998560 Multilayer ceramic substrate, method for producing same, and electronic component
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US Patent 7998561 Ceramic laminate and method of manufacturing ceramic sintered body
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US Patent 8012586 Diamond like carbon coating of substrate housings
Edits on 13 Dec, 2021
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Golden AI
edited on 13 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 8012586 Diamond like carbon coating of substrate housings
Edits on 8 Dec, 2021
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7998561 Ceramic laminate and method of manufacturing ceramic sintered body
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7998560 Multilayer ceramic substrate, method for producing same, and electronic component
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7989080 Method and apparatus for providing hermetic electrical feedthrough
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7985488 Ultrathin copper foil with carrier and printed circuit board using same
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Golden AI
edited on 8 Dec, 2021
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7981508 Flexible circuits
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7976940 Component, method for coating a component, and powder
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7976956 Laminated circuit board
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Golden AI
edited on 8 Dec, 2021
Edits on 8 Dec, 2021
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7968804 Methods of patterning a deposit metal on a substrate
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7968187 Surface coating
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7964801 Circuit board structure and fabrication method thereof
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Golden AI
edited on 8 Dec, 2021
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Golden AI
edited on 7 Dec, 2021
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Golden AI
edited on 7 Dec, 2021
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Golden AI
edited on 7 Dec, 2021

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