Endicott Interconnect Technologies, Inc.

US Patent 7087441 Method of making a circuitized substrate having a plurality of solder connection sites thereon

US Patent 7087846 Pinned electronic package with strengthened conductive pad

US Patent 7091066 Method of making circuitized substrate

US Patent 7109732 Electronic component test apparatus

US Patent 7129732 Substrate test apparatus and method of testing substrates

US Patent 7142121 Radio frequency device for tracking goods

US Patent 7145221 Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same

US Patent 7152319 Method of making high speed circuit board

US Patent 7157646 Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same

US Patent 7157647 Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same

US Patent 7161810 Stacked chip electronic package having laminate carrier and method of making same

US Patent 7163847 Method of making circuitized substrate

US Patent 7169313 Plating method for circuitized substrates

US Patent 7176383 Printed circuit board with low cross-talk noise

US Patent 7209368 Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making

US Patent 7211289 Method of making multilayered printed circuit board with filled conductive holes

US Patent 7211470 Method and apparatus for depositing conductive paste in circuitized substrate openings

US Patent 7235745 Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate

US Patent 7253502 Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same

US Patent 7253518 Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same

US Patent 7261466 Imaging inspection apparatus with directional cooling

US Patent 7270845 Dielectric composition for forming dielectric layer for use in circuitized substrates

US Patent 7292055 Interposer for use with test apparatus

US Patent 7293355 Apparatus and method for making circuitized substrates in a continuous manner

US Patent 7294791 Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same

US Patent 7307022 Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof

US Patent 7326643 Method of making circuitized substrate with internal organic memory device

US Patent 7328502 Apparatus for making circuitized substrates in a continuous manner

US Patent 7332212 Circuitized substrate with conductive polymer and seed material adhesion layer

US Patent 7332818 Multi-chip electronic package with reduced line skew and circuitized substrate for use therein

US Patent 7334323 Method of making mutilayered circuitized substrate assembly having sintered paste connections

US Patent 7342183 Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same

US Patent 7343674 Method of making circuitized substrate assembly

US Patent 7348677 Method of providing printed circuit board with conductive holes and board resulting therefrom

US Patent 7354197 Imaging inspection apparatus with improved cooling

US Patent 7376218 X-ray source assembly

US Patent 7377033 Method of making circuitized substrate with split conductive layer and information handling system utilizing same

US Patent 7381587 Method of making circuitized substrate

US Patent 7383629 Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof

US Patent 7384856 Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate

US Patent 7416972 Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion

US Patent 7416996 Method of making circuitized substrate

US Patent 7429510 Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate

US Patent 7429789 Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same

US Patent 7441709 Electronic card assembly

US Patent 7470990 Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same

US Patent 7478472 Method of making circuitized substrate with signal wire shielding

US Patent 7490984 Method of making an imaging inspection apparatus with improved cooling

US Patent 7491896 Information handling system utilizing circuitized substrate with split conductive layer

US Patent 7501839 Interposer and test assembly for testing electronic devices

US Patent 7508076 Information handling system including a circuitized substrate having a dielectric layer without continuous fibers

US Patent 7510324 Method of inspecting articles using imaging inspection apparatus with directional cooling

US Patent 7510912 Method of making wirebond electronic package with enhanced chip pad design

US Patent 7511518 Method of making an interposer

US Patent 7530167 Method of making a printed circuit board with low cross-talk noise

US Patent 7541058 Method of making circuitized substrate with internal optical pathway

US Patent 7541265 Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

US Patent 7547577 Method of making circuitized substrate with solder paste connections

US Patent 7589283 Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system

US Patent 7595454 Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate

US Patent 7596863 Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein

US Patent 7612345 Radiation detector crystal and method of formation thereof

US Patent 7622384 Method of making multi-chip electronic package with reduced line skew

US Patent 7627947 Method for making a multilayered circuitized substrate

US Patent 7629541 High speed interposer

US Patent 7629559 Method of improving electrical connections in circuitized substrates

US Patent 7629684 Adjustable thickness thermal interposer and electronic package utilizing same

US Patent 7633068 Count uniformity correction in flux space for pixilated semiconducting radiation detectors

US Patent 7635552 Photoresist composition with antibacterial agent

US Patent 7638776 Staggered array imaging system using pixilated radiation detectors

US Patent 7646098 Multilayered circuitized substrate with p-aramid dielectric layers and method of making same

US Patent 7665207 Method of making a multi-chip electronic package having laminate carrier

US Patent 7679005 Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same

US Patent 7687722 Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same

US Patent 7687724 Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate

US Patent 7705319 CdZnTe device using constrained design for high-flux x-ray spectroscopic imaging applications

US Patent 7705320 Radiation detector with co-planar grid structure

US Patent 7712210 Method of providing a printed circuit board with an edge connection portion

US Patent 7713767 Method of making circuitized substrate with internal optical pathway using photolithography

US Patent 7738249 Circuitized substrate with internal cooling structure and electrical assembly utilizing same

US Patent 7738631 Energy discriminating scatter imaging system

US Patent 7791897 Multi-layer embedded capacitance and resistance substrate core

US Patent 7800916 Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same

US Patent 7801833 Item identification control method

US Patent 7803688 Capacitive substrate and method of making same

US Patent 7814649 Method of making circuitized substrate with filled isolation border

US Patent 7823274 Method of making multilayered circuitized substrate assembly

US Patent 7827682 Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner

US Patent 7838776 Circuitized substrates utilizing smooth-sided conductive layers as part thereof

US Patent 7841741 LED lighting assembly and lamp utilizing same

US Patent 7851906 Flexible circuit electronic package with standoffs

US Patent 7870664 Method of making circuitized substrate with a resistor

US Patent 7875811 High speed interposer

US Patent 7897877 Capacitive substrate

US Patent 7910156 Method of making circuitized substrate with selected conductors having solder thereon

US Patent 7931830 Dielectric composition for use in circuitized substrates and circuitized substrate including same

US Patent 7972178 High density connector for interconnecting fine pitch circuit packaging structures

US Patent 7977034 Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner