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Ishwarbhai B. Patel

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Edits on 10 Aug, 2022
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godwinno feliks
edited on 10 Aug, 2022
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Edits on 14 Dec, 2021
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Golden AI
edited on 14 Dec, 2021
Edits made to:
Infobox (-88 properties)
Infobox
Patent primary examiner of
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US Patent 7498522 Multilayer printed circuit board and manufacturing method thereof
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US Patent 7629541 High speed interposer
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US Patent 7645944 Printed circuit board for high-speed electrical connectors
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US Patent 7656676 Removable data storage device and related assembling method
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US Patent 7663063 Circuit board with improved ground plane
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US Patent 7663064 High-speed flex printed circuit and method of manufacturing
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US Patent 7667144 Circuit board and method of fabricating the same
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US Patent 7671281 Multilayer wiring circuit board
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US Patent 7679003 Carrier tape
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US Patent 7687722 Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same
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US Patent 7687724 Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate
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US Patent 7696441 Flexible wired circuit board
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US Patent 7705245 Electronic device substrate and its fabrication method, and electronic device and its fabrication method
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US Patent 7709742 Superconductor cable
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US Patent 7714232 Circuit device and method of manufacturing the same
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US Patent 7714233 Printed wiring board
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US Patent 7718903 Component placement substrate and production method thereof
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US Patent 7718904 Enhancing shock resistance in semiconductor packages
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US Patent 7723617 Wired circuit board and production method thereof
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US Patent 7723618 Shifted segment layout for differential signal traces to mitigate bundle weave effect
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US Patent 7737367 Multilayer circuit board and manufacturing method thereof
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US Patent 7745736 Interconnecting substrate and semiconductor device
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US Patent 7750248 Dielectric lamination structure, manufacturing method of a dielectric lamination structure, and wiring board including a dielectric lamination structure
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US Patent 7754979 Solder-bearing wafer for use in soldering operations
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US Patent 7754980 Substrate with multilayer plated through hole and method for forming the multilayer plated through hole
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US Patent 7759582 Multilayer printed wiring board
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US Patent 7763809 Multilayered substrate for semiconductor device and method of manufacturing same
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US Patent 7767912 Integrated circuit carrier arrangement with electrical connection islands
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US Patent 7767913 Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methods
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US Patent 7777136 Multi-layered interconnect structure using liquid crystalline polymer dielectric
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US Patent 7786389 Flexible printed wiring board
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US Patent 7800002 Multilayer wiring board
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US Patent 7804031 Printed wiring board and manufacturing method thereof
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US Patent 7816610 Layout circuit
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US Patent 7816611 Circuit board
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US Patent 7820916 Composite ceramic substrate
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US Patent 7829797 Three channel raceway
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US Patent 7834277 Printed circuit board manufacturing method and printed circuit board
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US Patent 7838776 Circuitized substrates utilizing smooth-sided conductive layers as part thereof
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US Patent 7838777 Signal transmission structure, package structure and bonding method thereof
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US Patent 7847198 Wiring board and method for manufacturing the same, and semiconductor device
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US Patent 7851707 Circuit board and method for manufacturing the same
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US Patent 7851708 Composite substrate and method for manufacturing composite substrate
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US Patent 7858885 Circuit board structure
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US Patent 7863524 Interposer and method for manufacturing the same
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US Patent 7875810 Electronic component-inspection wiring board and method of manufacturing the same
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US Patent 7875811 High speed interposer
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US Patent 7880091 Electronic device substrate, electronic device and methods for making same
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US Patent 7902464 Heat sink arrangement for electrical apparatus
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US Patent 7902465 Optimizing PCB power and ground connections for lead free solder processes
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US Patent 7911799 Unit for accommodating electronic component
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US Patent 7915537 Interposer and method for making interposers
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US Patent 7915538 Multilayer wiring board and its manufacturing method
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US Patent 7915541 Multilayer interconnection substrate and manufacturing method therefor
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US Patent 7919714 System and a method for controlling flow of solder
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US Patent 7923644 Printed circuit board and method of manufacturing the same
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US Patent 7929311 Portable electronic device
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US Patent 7932470 Printed wiring board
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US Patent 7943852 Superconducting cable
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US Patent 7943855 Flexible printed circuit board and electronic component assembly
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US Patent 7943861 Printed wiring board and method for manufacturing printed wiring board
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US Patent 7948760 Transmission/reception optical module
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US Patent 7956291 Multilayer printed wiring board
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US Patent 7956293 Multilayer printed wiring board and manufacturing method thereof
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US Patent 7964800 Printed wiring board, method for forming the printed wiring board, and board interconnection structure
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US Patent 7968798 Flexible printed board
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US Patent 7968803 Wiring substrate, wiring material, copper-clad laminate, and method of manufacturing the wiring substrate
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US Patent 7973244 Printed circuit board
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US Patent 7973245 Wiring board and capacitor to be built into wiring board
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US Patent 7973249 Multilayer printed wiring board
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US Patent 7977578 Tab tape for tape carrier package
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US Patent 7977579 Multiple flip-chip integrated circuit package system
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US Patent 7977581 Shifted segment layout for differential signal traces to mitigate bundle weave effect
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US Patent 7977582 Flexible multilayer printed circuit assembly with reduced EMI emissions
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US Patent 7982135 Flex-rigid wiring board and method of manufacturing the same
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US Patent 7982139 Multilayer printed wiring board
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US Patent 7985925 Superconducting cable and method for the production thereof
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US Patent 7985926 Printed circuit board and electronic component device
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US Patent 7985930 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
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US Patent 7994430 Mounting structure, electro-optical device, electronic apparatus, and method of producing the mounting structure
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US Patent 7994431 Substrate with built-in electronic component and method for manufacturing the same
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US Patent 7994432 Heat resistant substrate incorporated circuit wiring board
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US Patent 7999194 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
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US Patent 8003892 Print circuit substrate and connection configuration of the same
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US Patent 8003894 Soldering nest for a bus bar
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US Patent 8003895 Electronic parts packaging structure and method of manufacturing the same
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US Patent 8003896 Multi-layer printed wiring board and manufacturing method thereof
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US Patent 8008583 Heat resistant substrate incorporated circuit wiring board
Edits on 8 Dec, 2021
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 8008583 Heat resistant substrate incorporated circuit wiring board
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 8003896 Multi-layer printed wiring board and manufacturing method thereof
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 8003892 Print circuit substrate and connection configuration of the same
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 8003895 Electronic parts packaging structure and method of manufacturing the same
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 8003894 Soldering nest for a bus bar
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7994432 Heat resistant substrate incorporated circuit wiring board
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7994431 Substrate with built-in electronic component and method for manufacturing the same
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Golden AI
edited on 8 Dec, 2021
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7985926 Printed circuit board and electronic component device
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7985925 Superconducting cable and method for the production thereof
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7982139 Multilayer printed wiring board
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7982135 Flex-rigid wiring board and method of manufacturing the same
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7977581 Shifted segment layout for differential signal traces to mitigate bundle weave effect
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7977582 Flexible multilayer printed circuit assembly with reduced EMI emissions
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7977578 Tab tape for tape carrier package
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7977579 Multiple flip-chip integrated circuit package system

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