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US Patent 11784140 Semiconductor device and method of manufacture

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
July 27, 2022
Date of Patent
October 10, 2023
Patent Application Number
17815338
Patent Citations
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US Patent 9048222 Method of fabricating interconnect structure for package-on-package devices
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US Patent 9048233 Package systems having interposers
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US Patent 9064879 Packaging methods and structures using a die attach film
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US Patent 9111949 Methods and apparatus of wafer level package for heterogeneous integration technology
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US Patent 9263511 Package with metal-insulator-metal capacitor and method of manufacturing the same
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US Patent 9281254 Methods of forming integrated circuit package
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US Patent 9299649 3D packages and methods for forming the same
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US Patent 9368460 Fan-out interconnect structure and method for forming same
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US Patent 9372206 Testing of semiconductor chips with microbumps
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US Patent 9425126 Dummy structure for chip-on-wafer-on-substrate
•••
Patent Citations Received
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US Patent 11967563 Fan-out package having a main die and a dummy die
0
Patent Inventor Names
Chen-Hua Yu
Jiun Yi Wu
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11784140
Patent Primary Examiner
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Victor A Mandala
CPC Code
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H01L 2924/3511
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H01L 2924/3512
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H01L 2924/35121
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H01L 23/49833
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H01L 23/49822
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H01L 23/5385
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H01L 21/4857

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