Novellus Systems

US Patent 7091134 Deposition of integrated circuit fabrication materials using a print head

US Patent 7094713 Methods for improving the cracking resistance of low-k dielectric materials

US Patent 7097410 Methods and apparatus for controlled-angle wafer positioning

US Patent 7097878 Mixed alkoxy precursors and methods of their use for rapid vapor deposition of SiO

US Patent 7105061 Method and apparatus for sealing substrate load port in a high pressure reactor

US Patent 7105082 Composition and method for electrodeposition of metal on a work piece

US Patent 7107998 Method for preventing and cleaning ruthenium-containing deposits in a CVD apparatus

US Patent 7109129 Optimal operation of conformal silica deposition reactors

US Patent 7115017 Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization

US Patent 7122485 Deposition profile modification through process chemistry

US Patent 7125313 Apparatus and method for abrading a workpiece

US Patent 7129189 Aluminum phosphate incorporation in silica thin films produced by rapid surface catalyzed vapor deposition (RVD)

US Patent 7135418 Optimal operation of conformal silica deposition reactors

US Patent 7141494 Method for reducing tungsten film roughness and improving step coverage

US Patent 7144806 ALD of tantalum using a hydride reducing agent

US Patent 7144822 High density plasma process for optimum film quality and electrical results

US Patent 7146994 Active rinse shield for electrofill chemical bath and method of use

US Patent 7148155 Sequential deposition/anneal film densification method

US Patent 7154731 Reflective coating for electrostatic chucks

US Patent 7157798 Selective refractory metal and nitride capping

US Patent 7160802 Adhesion of tungsten nitride films to a silicon surface

US Patent 7160813 Etch back process approach in dual source plasma reactors

US Patent 7163889 Film for copper diffusion barrier

US Patent 7163896 Biased H

US Patent 7163899 Localized energy pulse rapid thermal anneal dielectric film densification method

US Patent 7166531 VLSI fabrication processes for introducing pores into dielectric materials

US Patent 7176039 Dynamic modification of gap fill process characteristics

US Patent 7176140 Adhesion promotion for etch by-products

US Patent 7176144 Plasma detemplating and silanol capping of porous dielectric films

US Patent 7179351 Methods and apparatus for magnetron sputtering

US Patent 7182673 Method and apparatus for post-CMP cleaning of a semiconductor work piece

US Patent 7186648 Barrier first method for single damascene trench applications

US Patent 7189140 Methods using eddy current for calibrating a CMP tool

US Patent 7189432 Varying conductance out of a process region to control gas flux in an ALD reactor

US Patent 7189647 Sequential station tool for wet processing of semiconductor wafers

US Patent 7195548 Method and apparatus for post-CMP cleaning of a semiconductor work piece

US Patent 7195696 Electrode assembly for electrochemical processing of workpiece

US Patent 7195700 Method of electroplating copper layers with flat topography

US Patent 7198545 Method of calibration and data evaluation for eddy current metrology systems

US Patent 7199048 Method for preventing metalorganic precursor penetration into porous dielectrics

US Patent 7201828 Planar plating apparatus

US Patent 7201829 Mask plate design

US Patent 7202176 Enhanced stripping of low-k films using downstream gas mixing

US Patent 7202185 Silica thin films produced by rapid surface catalyzed vapor deposition (RVD) using a nucleation layer

US Patent 7204743 Integrated circuit interconnect fabrication systems

US Patent 7204917 Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same

US Patent 7204924 Method and apparatus to deposit layers with uniform properties

US Patent 7208389 Method of porogen removal from porous low-k films using UV radiation

US Patent 7211174 Method and system to provide electrical contacts for electrotreating processes

US Patent 7211175 Method and apparatus for potential controlled electroplating of fine patterns on semiconductor wafers

US Patent 7211186 Method and system to provide electrical contacts for electrotreating processes

US Patent 7211509 Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compounds

US Patent 7211525 Hydrogen treatment enhanced gap fill

US Patent 7214630 PMOS transistor with compressive dielectric capping layer

US Patent 7217398 Deposition reactor with precursor recycle

US Patent 7217658 Process modulation to prevent structure erosion during gap fill

US Patent 7223707 Dynamic rapid vapor deposition process for conformal silica laminates

US Patent 7229339 CMP apparatus and method

US Patent 7232513 Electroplating bath containing wetting agent for defect reduction

US Patent 7239017 Low-k B-doped SiC copper diffusion barrier films

US Patent 7241704 Methods for producing low stress porous low-k dielectric materials using precursors with organic functional groups

US Patent 7247558 Method and system for electroprocessing conductive layers

US Patent 7250103 Method and apparatus for eliminating defects and improving uniformity in electrochemically processed conductive layers

US Patent 7253125 Method to improve mechanical strength of low-k dielectric film using modulated UV exposure

US Patent 7257893 Efficient wafer processing technology

US Patent 7262125 Method of forming low-resistivity tungsten interconnects

US Patent 7264537 Methods for monitoring a chemical mechanical planarization process of a metal layer using an in-situ eddy current measuring system

US Patent 7265061 Method and apparatus for UV exposure of low dielectric constant materials for porogen removal and improved mechanical properties

US Patent 7271112 Methods for forming high density, conformal, silica nanolaminate films via pulsed deposition layer in structures of confined geometry

US Patent 7273808 Reactive barrier/seed preclean process for damascene process

US Patent 7279417 Use of metallocenes to inhibit copper oxidation during semiconductor processing

US Patent 7282438 Low-k SiC copper diffusion barrier films

US Patent 7288463 Pulsed deposition layer gap fill with expansion material

US Patent 7288484 Photoresist strip method for low-k dielectrics

US Patent 7294583 Methods for the use of alkoxysilanol precursors for vapor deposition of SiO

US Patent 7297239 Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface

US Patent 7297608 Method for controlling properties of conformal silica nanolaminates formed by rapid vapor deposition

US Patent 7309406 Method and apparatus for plating and polishing semiconductor substrate

US Patent 7309407 Method and apparatus for forming an electrical contact with a semiconductor substrate

US Patent 7309413 Providing electrical contact to the surface of a semiconductor workpiece during processing

US Patent 7311811 Device providing electrical contact to the surface of a semiconductor workpiece during processing

US Patent 7316602 Constant low force wafer carrier for electrochemical mechanical processing and chemical mechanical polishing

US Patent 7318869 Variable gas conductance control for a process chamber

US Patent 7326444 Methods for improving integration performance of low stress CDO films

US Patent 7327001 PMOS transistor with compressive dielectric capping layer

US Patent 7327948 Cast pedestal with heating element and coaxial heat exchanger

US Patent 7329335 Device providing electrical contact to the surface of a semiconductor workpiece during processing

US Patent 7335092 Carrier head for workpiece planarization/polishing

US Patent 7335288 Methods for depositing copper on a noble metal layer of a work piece

US Patent 7338908 Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltage

US Patent 7341649 Apparatus for electroprocessing a workpiece surface

US Patent 7341761 Methods for producing low-k CDO films

US Patent 7341946 Methods for the electrochemical deposition of copper onto a barrier layer of a work piece

US Patent 7344996 Helium-based etch process in deposition-etch-deposition gap fill

US Patent 7348042 Continuous method for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD)

US Patent 7354335 CMP apparatus and load cup mechanism

US Patent 7361582 Method of forming a damascene structure with integrated planar dielectric layers

US Patent 7378004 Pad designs and structures for a versatile materials processing apparatus

US Patent 7381451 Strain engineering—HDP thin film with tensile stress for FEOL and other applications

US Patent 7381644 Pulsed PECVD method for modulating hydrogen content in hard mask

US Patent 7381662 Methods for improving the cracking resistance of low-k dielectric materials

US Patent 7390537 Methods for producing low-k CDO films with low residual stress

US Patent 7391086 Conductive contacts and methods for fabricating conductive contacts for elctrochemical planarization of a work piece

US Patent 7396759 Protection of Cu damascene interconnects by formation of a self-aligned buffer layer

US Patent 7399516 Long-life workpiece surface influencing device structure and manufacturing method

US Patent 7399712 Method for etching organic hardmasks

US Patent 7402098 Carrier head for workpiece planarization/polishing

US Patent 7404886 Plating by creating a differential between additives disposed on a surface portion and a cavity portion of a workpiece

US Patent 7405157 Methods for the electrochemical deposition of copper onto a barrier layer of a work piece

US Patent 7405163 Selectively accelerated plating of metal features

US Patent 7413616 Active rinse shield for electrofill chemical bath and method of use

US Patent 7416975 Method of forming contact layers on substrates

US Patent 7416989 Adsorption based material removal process

US Patent 7420275 Boron-doped SIC copper diffusion barrier films

US Patent 7422700 Compositions and methods of electrochemical removal of material from a barrier layer of a wafer

US Patent 7425250 Electrochemical mechanical processing apparatus

US Patent 7425506 Methods of providing an adhesion layer for adhesion of barrier and/or seed layers to dielectric films

US Patent 7427337 System for electropolishing and electrochemical mechanical polishing

US Patent 7428470 Method for monitoring edge exclusion during chemical mechanical planarization

US Patent 7435323 Method for controlling thickness uniformity of electroplated layers

US Patent 7435684 Resolving of fluorine loading effect in the vacuum chamber

US Patent 7442267 Anneal of ruthenium seed layer to improve copper plating

US Patent 7446032 Methods of providing an adhesion layer for adhesion of barrier and/or seed layers to dielectric films

US Patent 7449098 Method for planar electroplating

US Patent 7449099 Selectively accelerated plating of metal features

US Patent 7456101 Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compounds

US Patent 7456102 Electroless copper fill process

US Patent 7468322 Methods of multi-step electrochemical mechanical planarization of Cu

US Patent 7473653 Methods for producing low stress porous low-k dielectric materials using precursors with organic functional groups

US Patent 7476304 Apparatus for processing surface of workpiece with small electrodes and surface contacts

US Patent 7476621 Halogen-free noble gas assisted H

US Patent 7477948 Apparatus and methods for precompiling program sequences for wafer processing

US Patent 7479191 Method for endpointing CVD chamber cleans following ultra low-k film treatments

US Patent 7482245 Stress profile modulation in STI gap fill

US Patent 7482247 Conformal nanolaminate dielectric deposition and etch bag gap fill process

US Patent 7491308 Method of making rolling electrical contact to wafer front surface

US Patent 7491653 Metal-free catalysts for pulsed deposition layer process for conformal silica laminates

US Patent 7503334 Apparatus and methods for processing semiconductor substrates using supercritical fluids

US Patent 7503830 Apparatus for reduction of defects in wet processed layers

US Patent 7510634 Apparatus and methods for deposition and/or etch selectivity

US Patent 7510982 Creation of porosity in low-k films by photo-disassociation of imbedded nanoparticles

US Patent 7514375 Pulsed bias having high pulse frequency for filling gaps with dielectric material

US Patent 7517444 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece

US Patent 7524735 Flowable film dielectric gap fill process

US Patent 7531079 Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation

US Patent 7531463 Fabrication of semiconductor interconnect structure

US Patent 7541200 Treatment of low k films with a silylating agent for damage repair

US Patent 7544115 Chemical mechanical polishing assembly with altered polishing pad topographical components

US Patent 7550070 Electrode and pad assembly for processing conductive layers

US Patent 7550851 Adhesion of tungsten nitride films to a silicon surface

US Patent 7558045 Electrostatic chuck assembly with capacitive sense feature, and related operating method

US Patent 7560016 Selectively accelerated plating of metal features

US Patent 7569123 Optimizing target erosion using multiple erosion regions in a magnetron sputtering apparatus

US Patent 7572354 Electrochemical processing of conductive surface

US Patent 7573061 Low-k SiC copper diffusion barrier films

US Patent 7576006 Protective self-aligned buffer layers for damascene interconnects

US Patent 7578923 Electropolishing system and process

US Patent 7582555 CVD flowable gap fill

US Patent 7585370 Gas-purged vacuum valve

US Patent 7585399 Rotating magnet arrays for magnetron sputtering apparatus

US Patent 7585777 Photoresist strip method for low-k dielectrics

US Patent 7589017 Methods for growing low-resistivity tungsten film

US Patent 7589028 Hydroxyl bond removal and film densification method for oxide films using microwave post treatment

US Patent 7601393 Controlling the temperature of a substrate in a film deposition apparatus

US Patent 7605082 Capping before barrier-removal IC fabrication method

US Patent 7611757 Method to improve mechanical strength of low-K dielectric film using modulated UV exposure

US Patent 7622024 High resistance ionic current source

US Patent 7622052 Methods for chemical mechanical planarization and for detecting endpoint of a CMP operation

US Patent 7622162 UV treatment of STI films for increasing tensile stress

US Patent 7622380 Method of improving adhesion between two dielectric films

US Patent 7622400 Method for improving mechanical properties of low dielectric constant materials

US Patent 7625820 Method of selective coverage of high aspect ratio structures with a conformal film

US Patent 7629224 VLSI fabrication processes for introducing pores into dielectric materials

US Patent 7629227 CVD flowable gap fill

US Patent 7632170 CMP apparatuses with polishing assemblies that provide for the passive removal of slurry

US Patent 7642202 Methods of forming moisture barrier for low k film integration with anti-reflective layers

US Patent 7645696 Deposition of thin continuous PVD seed layers having improved adhesion to the barrier layer

US Patent 7648622 System and method for electrochemical mechanical polishing

US Patent 7648899 Interfacial layers for electromigration resistance improvement in damascene interconnects

US Patent 7655567 Methods for improving uniformity and resistivity of thin tungsten films

US Patent 7659197 Selective resputtering of metal seed layers

US Patent 7670931 Methods for fabricating semiconductor structures with backside stress layers

US Patent 7678709 Method of forming low-temperature conformal dielectric films

US Patent 7682498 Rotationally asymmetric variable electrode correction

US Patent 7682966 Multistep method of depositing metal seed layers

US Patent 7686927 Methods and apparatus for controlled-angle wafer positioning

US Patent 7686935 Pad-assisted electropolishing

US Patent 7690324 Small-volume electroless plating cell

US Patent 7691749 Deposition of tungsten nitride

US Patent 7695597 Conductive planarization assembly for electrochemical mechanical planarization of a work piece

US Patent 7695765 Methods for producing low-stress carbon-doped oxide films with improved integration properties

US Patent 7696538 Sensor for measuring liquid contaminants in a semiconductor wafer fabrication process

US Patent 7700155 Method and apparatus for modulation of precursor exposure during a pulsed deposition process

US Patent 7704873 Protective self-aligned buffer layers for damascene interconnects

US Patent 7704880 Method of forming contact layers on substrates

US Patent 7704894 Method of eliminating small bin defects in high throughput TEOS films

US Patent 7725205 Apparatus and methods for providing a homogenous I/O interface for controlling a heterogenous mixture of hardware I/O systems

US Patent 7727863 Sonic irradiation during wafer immersion

US Patent 7727880 Protective self-aligned buffer layers for damascene interconnects

US Patent 7727881 Protective self-aligned buffer layers for damascene interconnects

US Patent 7727882 Compositionally graded titanium nitride film for diffusion barrier applications

US Patent 7727906 H2-based plasma treatment to eliminate within-batch and batch-to-batch etch drift

US Patent 7731833 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece

US Patent 7732314 Method for depositing a diffusion barrier for copper interconnect applications

US Patent 7737035 Dual seal deposition process chamber and process

US Patent 7737525 Method for producing low-K CDO films

US Patent 7740768 Simultaneous front side ash and backside clean

US Patent 7745332 PVD-based metallization methods for fabrication of interconnections in semiconductor devices

US Patent 7745346 Method for improving process control and film conformality of PECVD film

US Patent 7754014 Gas-purged vacuum valve

US Patent 7754061 Method for controlling conductor deposition on predetermined portions of a wafer

US Patent 7754604 Reducing silicon attack and improving resistivity of tungsten nitride film

US Patent 7772114 Method for improving uniformity and adhesion of low resistivity tungsten film

US Patent 7776741 Process for through silicon via filing

US Patent 7780867 Edge bevel removal of copper from silicon wafers

US Patent 7781327 Resputtering process for eliminating dielectric damage

US Patent 7781351 Methods for producing low-k carbon doped oxide films with low residual stress

US Patent 7790633 Sequential deposition/anneal film densification method

US Patent 7799200 Selective electrochemical accelerator removal

US Patent 7799671 Interfacial layers for electromigration resistance improvement in damascene interconnects

US Patent 7799684 Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers

US Patent 7799705 Methods for producing low stress porous low-k dielectric materials using precursors with organic functional groups

US Patent 7806983 Substrate temperature control in an ALD reactor

US Patent 7811153 High throughput servo load cup with integrated wet chemistry delivery

US Patent 7811925 Capping before barrier-removal IC fabrication method

US Patent 7820556 Method for purifying acetylene gas for use in semiconductor processes

US Patent 7842604 Low-k b-doped SiC copper diffusion barrier films

US Patent 7842605 Atomic layer profiling of diffusion barrier and metal seed layers

US Patent 7851232 UV treatment for carbon-containing low-k dielectric repair in semiconductor processing

US Patent 7854828 Method and apparatus for electroplating including remotely positioned second cathode

US Patent 7855147 Methods and apparatus for engineering an interface between a diffusion barrier layer and a seed layer

US Patent 7858510 Interfacial layers for electromigration resistance improvement in damascene interconnects

US Patent 7863190 Method of selective coverage of high aspect ratio structures with a conformal film

US Patent 7871676 System for depositing a film by modulated ion-induced atomic layer deposition (MII-ALD)

US Patent 7871678 Method of increasing the reactivity of a precursor in a cyclic deposition process

US Patent 7879218 Deposit morphology of electroplated copper

US Patent 7887392 Platen assembly and work piece carrier head employing flexible circuit sensor

US Patent 7887396 Method and apparatus for controlled slurry distribution

US Patent 7888233 Flowable film dielectric gap fill process

US Patent 7888273 Density gradient-free gap fill

US Patent 7892405 Methods and apparatus for magnetron sputtering

US Patent 7892985 Method for porogen removal and mechanical strength enhancement of low-k carbon doped silicon oxide using low thermal budget microwave curing

US Patent 7897198 Electroless layer plating process and apparatus

US Patent 7897215 Sequential UV induced chemical vapor deposition

US Patent 7897516 Use of ultra-high magnetic fields in resputter and plasma etching

US Patent 7906174 PECVD methods for producing ultra low-k dielectric films using UV treatment

US Patent 7906817 High compressive stress carbon liners for MOS devices

US Patent 7915139 CVD flowable gap fill

US Patent 7915166 Diffusion barrier and etch stop films

US Patent 7922880 Method and apparatus for increasing local plasma density in magnetically confined plasma

US Patent 7923376 Method of reducing defects in PECVD TEOS films

US Patent 7923385 Methods for producing low stress porous and CDO low-K dielectric materials using precursors with organic functional groups

US Patent 7935231 Rapidly cleanable electroplating cup assembly

US Patent 7935940 Measuring in-situ UV intensity in UV cure tool

US Patent 7941039 Pedestal heat transfer and temperature control

US Patent 7947163 Photoresist-free metal deposition

US Patent 7951683 In-situ process layer using silicon-rich-oxide for etch selectivity in high AR gapfill

US Patent 7955972 Methods for growing low-resistivity tungsten for high aspect ratio and small features

US Patent 7955990 Method for improved thickness repeatability of PECVD deposited carbon films

US Patent 7960297 Load lock design for rapid wafer heating

US Patent 7964504 PVD-based metallization methods for fabrication of interconnections in semiconductor devices

US Patent 7964506 Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers

US Patent 7967969 Method of electroplating using a high resistance ionic current source

US Patent 7968436 Low-K SiC copper diffusion barrier films

US Patent 7972970 Fabrication of semiconductor interconnect structure

US Patent 7972976 VLSI fabrication processes for introducing pores into dielectric materials

US Patent 7977249 Methods for removing silicon nitride and other materials during fabrication of contacts

US Patent D641829 Plasma reactor showerhead face plate having concentric ridge pattern

US Patent 7981763 Atomic layer removal for high aspect ratio gapfill

US Patent 7981777 Methods of depositing stable and hermetic ashable hardmask films

US Patent 7981810 Methods of depositing highly selective transparent ashable hardmask films

US Patent 7985325 Closed contact electroplating cup assembly

US Patent 7993457 Deposition sub-chamber with variable flow

US Patent 7994640 Nanoparticle cap layer

US Patent 7998881 Method for making high stress boron-doped carbon films

US Patent 8003549 Methods of forming moisture barrier for low K film integration with anti-reflective layers