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Chris Chu

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Edits on 20 Aug, 2022
"Edit from table cell"
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godwinno feliks
edited on 20 Aug, 2022
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Twitter URL
https://twitter.com/chris___chu
Edits on 15 Dec, 2021
"Remove inverse infobox"
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Golden AI
edited on 15 Dec, 2021
Edits made to:
Infobox (-112 properties)
Infobox
Patent primary examiner of
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US Patent 7582919 Functional coating of the SCFM preform
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US Patent 7768052 Process to improve high-performance capacitors in integrated MOS technologies
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US Patent 7768120 Heat spreader and semiconductor device using the same
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US Patent 7768125 Multi-chip package system
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US Patent 7781250 Wafer level chip size package for MEMS devices and method for fabricating the same
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US Patent 7781852 Membrane die attach circuit element package and method therefor
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US Patent 7786548 Electric element, memory device, and semiconductor integrated circuit
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US Patent 7786571 Heat-conductive package structure
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US Patent 7790270 Wiring board and semiconductor device
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US Patent 7791120 Circuit device and manufacturing method thereof
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US Patent 7791190 Substrate with crystal silicon array
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US Patent 7791193 Pad over active circuit system and method with meshed support structure
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US Patent 7795633 Optoelectronic component
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US Patent 7795700 Inductively coupled integrated circuit with magnetic communication path and methods for use therewith
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US Patent 7795727 Semiconductor module having discrete components and method for producing the same
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US Patent 7800190 Getter on die in an upper sense plate designed system
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US Patent 7800219 High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same
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US Patent 7800239 Thick metal interconnect with metal pad caps at selective sites and process for making the same
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US Patent 7800240 Under bump metallurgy structure and wafer structure using the same and method of manufacturing wafer structure
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US Patent 7804131 Multi-chip module
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US Patent 7808089 Leadframe having die attach pad with delamination and crack-arresting features
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US Patent 7808100 Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element
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US Patent 7808104 Substrate for mounting electronic component and electronic apparatus including the substrate
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US Patent 7812445 Semiconductor memory module having an oblique memory chip
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US Patent 7812446 Semiconductor device
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US Patent 7816676 Hermetically sealed package and methods of making the same
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US Patent 7816788 Structure, method and system for assessing bonding of electrodes in FCB packaging
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US Patent 7825436 Thin film electron source
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US Patent 7825517 Method for packaging semiconductor dies having through-silicon vias
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US Patent 7829977 Low temperature co-fired ceramics substrate and semiconductor package
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US Patent 7829986 Integrated circuit package system with net spacer
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US Patent 7829991 Stackable ceramic FBGA for high thermal applications
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US Patent 7830007 Electronic device, method of producing the same, and semiconductor device
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US Patent 7830022 Semiconductor package
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US Patent 7834432 Chip package having asymmetric molding
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US Patent 7834464 Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
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US Patent 7842615 Semiconductor device having a copper metal line and method of forming the same
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US Patent 7846752 High power LED housing and fabrication method thereof
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US Patent 7847390 Semiconductor device
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US Patent 7847391 Manufacturing method for integrating a shunt resistor into a semiconductor package
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US Patent 7847415 Method for manufacturing a multichip module assembly
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US Patent 7851268 Integrated circuit package system using heat slug
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US Patent 7851832 Semiconductor device
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US Patent 7851917 Wiring structure and method of manufacturing the same
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US Patent 7851926 Semiconductor device
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US Patent 7851928 Semiconductor device having substrate with differentially plated copper and selective solder
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US Patent 7855136 Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumps
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US Patent 7858519 Integrated circuit and manufacturing method of copper germanide and copper silicide as copper capping layer
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US Patent 7863101 Stacking semiconductor device and production method thereof
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US Patent 7863699 Bonded wafer package module
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US Patent 7863722 Stackable semiconductor assemblies and methods of manufacturing such assemblies
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US Patent 7868362 SOI on package hypersensitive sensor
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US Patent 7868413 Semiconductor device
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US Patent 7868451 Resin sealing semiconductor device and electronic device using resin sealing semiconductor device
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US Patent 7868460 Semiconductor package and method of manufacturing the same
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US Patent 7876144 Start-up circuit and start-up method
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US Patent 7880276 Wiring board and semiconductor device
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US Patent 7880294 Potential-free housing leadthrough
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US Patent 7888179 Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof
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US Patent 7892892 Semiconductor device and method for manufacturing thereof
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US Patent 7893530 Circuit substrate and the semiconductor package having the same
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US Patent 7893545 Semiconductor device
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US Patent 7897507 Barrier layer configurations and methods for processing microelectronic topographies having barrier layers
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US Patent 7898087 Integrated chip carrier with compliant interconnects
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US Patent 7898095 Fiducial scheme adapted for stacked integrated circuits
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US Patent 7902644 Integrated circuit package system for electromagnetic isolation
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US Patent 7902669 Semiconductor device and method for manufacturing the same
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US Patent 7902681 Semiconductor device, production method for the same, and substrate
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US Patent 7906376 Magnetic particle-based composite materials for semiconductor packages
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US Patent 7906850 Structure of circuit board and method for fabricating same
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US Patent 7906860 Semiconductor device
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US Patent 7911040 Integrated circuit package with improved connections
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US Patent 7915141 Deterministic generation of an integrated circuit identification number
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US Patent 7915742 Determining the placement of semiconductor components on an integrated circuit
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US Patent 7919851 Laminate substrate and semiconductor package utilizing the substrate
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US Patent 7923793 Image sensor module and fabrication method thereof
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US Patent 7928558 Production of an electrical component and component
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US Patent 7932171 Dual metal stud bumping for flip chip applications
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US Patent 7932605 Semiconductor device and manufacturing method therefor
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US Patent 7932786 Surface mount type crystal oscillator
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US Patent 7935573 Electronic device and method for fabricating the same
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US Patent 7939920 Multiple die integrated circuit package
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US Patent RE42363 Stackable electronic assembly
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US Patent 7944015 Semiconductor device and method of manufacturing the same
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US Patent 7944032 Integrated circuit package with molded insulation
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US Patent 7947592 Thick metal interconnect with metal pad caps at selective sites and process for making the same
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US Patent 7948046 Optoelectronic component
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US Patent 7948060 Integrated circuit structure
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US Patent 7948094 Semiconductor device
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US Patent 7952210 Semiconductor package and fabrication method thereof
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US Patent 7956449 Stacked integrated circuit package system
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US Patent 7960800 Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
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US Patent 7968894 LED package frame and LED package having the same
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US Patent 7968987 Carbon dioxide gettering for a chip module assembly
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US Patent 7972877 Fabricating method of light emitting diode package
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US Patent 7973405 Integrated circuit for driving semiconductor device and power converter
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US Patent 7977768 Semiconductor devices and methods of manufacture thereof
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US Patent 7977782 Integrated circuit package system with dual connectivity
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US Patent 7977805 Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate
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US Patent 7982305 Integrated circuit package including a three-dimensional fan-out / fan-in signal routing
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US Patent 7982318 Device including contact structure and method of forming the same
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US Patent 7989951 Die assemblies
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US Patent 7989964 Semiconductor integrated circuit
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US Patent 7994547 Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects
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US Patent 7994613 Semiconductor device and method for manufacturing the same
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US Patent 7994618 Sensor module and method for manufacturing same
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US Patent 7996813 Method for generating pattern, method for manufacturing semiconductor device, semiconductor device, and computer program
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US Patent 7999380 Process for manufacturing substrate with bumps and substrate structure
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US Patent 7999397 Microelectronic packages and methods therefor
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US Patent 8008758 Semiconductor device with increased I/O leadframe
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US Patent 8008762 Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
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US Patent 8008980 Surface mount type crystal oscillator
Edits on 8 Dec, 2021
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Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 8008980 Surface mount type crystal oscillator
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Golden AI
edited on 8 Dec, 2021
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 8008758 Semiconductor device with increased I/O leadframe
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7999397 Microelectronic packages and methods therefor
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7999380 Process for manufacturing substrate with bumps and substrate structure
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7994618 Sensor module and method for manufacturing same
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7994613 Semiconductor device and method for manufacturing the same
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7989964 Semiconductor integrated circuit
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7989951 Die assemblies
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7982318 Device including contact structure and method of forming the same
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7982305 Integrated circuit package including a three-dimensional fan-out / fan-in signal routing
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7977782 Integrated circuit package system with dual connectivity
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7977768 Semiconductor devices and methods of manufacture thereof
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7973405 Integrated circuit for driving semiconductor device and power converter
Golden AI profile picture
Golden AI
edited on 8 Dec, 2021
Edits made to:
Infobox (+1 properties)
Infobox
Patent primary examiner of
‌
US Patent 7972877 Fabricating method of light emitting diode package

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