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Edits on 9 Sep, 2022
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Golden AI
edited on 9 Sep, 2022
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Doctoral Advisor
Arthur Eddington
Arthur Eddington
Edits on 15 Dec, 2021
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Golden AI
edited on 15 Dec, 2021
Edits made to:
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Patent primary examiner of
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US Patent 7087496 Seal ring for integrated circuits
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US Patent 7087988 Semiconductor packaging apparatus
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US Patent 7088004 Flip-chip device having conductive connectors
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US Patent 7095095 Semiconductor constructions
‌
US Patent 7095096 Microarray lead frame
‌
US Patent 7105911 Multilayer electronic substrate, and the method of manufacturing multilayer electronic substrate
‌
US Patent 7105932 Power semiconductor module
‌
US Patent 7109130 Zeolite films for low k applications
‌
US Patent 7109587 Apparatus and method for enhanced thermal conductivity packages for high powered semiconductor devices
‌
US Patent 7112520 Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
‌
US Patent 7112863 Optical device, optical module, semiconductor apparatus and its manufacturing method, and electronic apparatus
‌
US Patent 7115961 Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
‌
US Patent 7115975 Semiconductor device, process of producing semiconductor device, and ink jet recording head
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US Patent 7115986 Flexible ball grid array chip scale packages
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US Patent 7115994 Semiconductor substrate and method of fabricating semiconductor device
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US Patent 7119437 Electronic substrate, power module and motor driver
‌
US Patent 7122829 Probe look ahead: testing parts not currently under a probehead
‌
US Patent 7122870 Methods of forming a multilayer stack alloy for work function engineering
‌
US Patent 7126230 Semiconductor electronic device and method of manufacturing thereof
‌
US Patent 7129574 Multi-power ring chip scale package for system level integration
‌
US Patent 7129577 Power supply packaging system
‌
US Patent 7129588 Portable telephone
‌
US Patent 7132740 Semiconductor package with conductor impedance selected during assembly
‌
US Patent 7135353 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
‌
US Patent 7135397 Method and system for packaging ball grid arrays
‌
US Patent 7135405 Method to form an interconnect
‌
US Patent 7144804 Semiconductor device and method of manufacturing the same
‌
US Patent 7145250 LSI package, LSI element testing method, and semiconductor device manufacturing method
‌
US Patent 7148577 Materials for electronic devices
‌
US Patent 7154174 Power supply packaging system
‌
US Patent 7161226 Multi-layered complementary wire structure and manufacturing method thereof
‌
US Patent 7161238 Structural reinforcement for electronic substrate
‌
US Patent 7164149 Semiconductor device, semiconductor device manufacturing method, and semiconductor device test method
‌
US Patent 7164205 Semiconductor carrier film, and semiconductor device and liquid crystal module using the same
‌
US Patent 7170091 Probe look ahead: testing parts not currently under a probehead
‌
US Patent 7170149 Semiconductor device and package, and method of manufacture therefor
‌
US Patent 7170154 Glass for window of semiconductor package, glass window for semiconductor package, process for production of glass window, and semiconductor package
‌
US Patent 7179685 Fabrication method for stacked multi-chip package
‌
US Patent 7179736 Method for fabricating planar semiconductor wafers
‌
US Patent 7179740 Integrated circuit with improved interconnect structure and process for making same
‌
US Patent 7183190 Semiconductor device and fabrication method therefor
‌
US Patent 7183653 Via including multiple electrical paths
‌
US Patent 7183655 Packaged semiconductor device
‌
US Patent 7186589 Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting
‌
US Patent 7195956 Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units
‌
US Patent 7196389 Optical semiconductor device package and optical semiconductor device
‌
US Patent 7196412 Multi-chip press-connected type semiconductor device
‌
US Patent 7196413 Heat dissipation assembly and method for producing the same
‌
US Patent 7199439 Microelectronic imagers and methods of packaging microelectronic imagers
‌
US Patent 7202554 Semiconductor package and its manufacturing method
‌
US Patent 7208821 Multichip leadframe package
‌
US Patent 7211903 Semiconductor device and manufacturing method of them
‌
US Patent 7217660 Method for manufacturing a semiconductor component that inhibits formation of wormholes
‌
US Patent 7223638 Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
‌
US Patent 7226856 Nano-electrode-array for integrated circuit interconnects
‌
US Patent 7227244 Integrated low k dielectrics and etch stops
‌
US Patent 7230330 Semiconductor die packages with recessed interconnecting structures
‌
US Patent 7230339 Copper ring solder mask defined ball grid array pad
‌
US Patent 7232709 Process for producing a semiconductor device
‌
US Patent 7233025 Electronic packaging for optical emitters and sensors
‌
US Patent 7239025 Selective deposition of solder ball contacts
‌
US Patent 7242083 Substrate for IC package
‌
US Patent 7242101 Integrated circuit die with pedestal
‌
US Patent 7247524 Manufacturing method of wiring substrate
‌
US Patent 7253531 Semiconductor bonding pad structure
‌
US Patent 7271029 Method of forming a package-ready light-sensitive integrated circuit
‌
US Patent 7271480 Constraint stiffener design
‌
US Patent RE39854 Lead frame chip scale package
‌
US Patent 7279786 Nested integrated circuit package on package system
‌
US Patent 7282797 Graded liquid crystal polymer package
‌
US Patent 7288440 Method of manufacturing a semiconductor device
‌
US Patent 7288459 Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same
‌
US Patent 7288462 Buffer zone for the prevention of metal migration
‌
US Patent 7288472 Method and system for performing die attach using a flame
‌
US Patent 7294910 Electronic component with multilayered rewiring plate and method for producing the same
‌
US Patent 7294924 Flat panel display device and method of fabricating the same
‌
US Patent 7294927 Semiconductor chip package and manufacturing method thereof
‌
US Patent 7298023 Electronic device with organic insulator
‌
US Patent 7298052 Micro chip-scale-package system
‌
US Patent 7306972 Semiconductor device and manufacturing method of the same
‌
US Patent 7307347 Resin-encapsulated package, lead member for the same and method of fabricating the lead member
‌
US Patent 7312518 Miniaturized multi-chip module and method for manufacturing the same
‌
US Patent 7317251 Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components
‌
US Patent 7320908 Methods of forming semiconductor devices having buried oxide patterns
‌
US Patent 7321159 Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs
‌
US Patent 7323788 Semiconductor device and manufacturing method of them
‌
US Patent 7327043 Two layer substrate ball grid array design
‌
US Patent 7339278 Cavity chip package
‌
US Patent 7339280 Semiconductor package with lead frame as chip carrier and method for fabricating the same
‌
US Patent 7339281 Circuit device and manufacturing method thereof
‌
US Patent 7341881 Methods of packaging and testing microelectronic imaging devices
‌
US Patent 7348217 Method and structure for interfacing electronic devices
‌
US Patent 7348273 Method of manufacturing a semiconductor device
‌
US Patent 7348668 Semiconductor device and method of manufacturing the same
‌
US Patent 7354858 Film formation method and apparatus for semiconductor process
‌
US Patent 7358541 Flip-chip light emitting diode and method of manufacturing the same
‌
US Patent 7358598 Process for fabricating a semiconductor package and semiconductor package with leadframe
‌
US Patent 7358614 Antisymmetric nanowire crossbars
‌
US Patent 7358617 Bond pad for ball grid array package
‌
US Patent 7361527 Image sensor with improved charge transfer efficiency and method for fabricating the same
‌
US Patent 7361593 Methods of forming vias in multilayer substrates
‌
US Patent 7361594 Method of manufacturing a thin film transistor, thin film transistor, thin film transistor circuit, electronic device, and electronic apparatus
‌
US Patent 7361972 Chip packaging structure for improving reliability
‌
US Patent 7365416 Multi-level semiconductor module and method for fabricating the same
‌
US Patent 7365417 Overhang integrated circuit package system
‌
US Patent 7365419 Surface-mount packaging for chip
‌
US Patent 7368323 Semiconductor device and manufacturing method thereof
‌
US Patent 7372136 Chip card retaining mechanism
‌
US Patent 7372157 Semiconductor device including titanium wires and manufacturing method therefor
‌
US Patent 7372168 Semiconductor chip capable of implementing wire bonding over active circuits
‌
US Patent 7374966 Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
‌
US Patent 7378728 Electronic component mounting package and package assembled substrate
‌
US Patent 7378743 Circuit board and electronic assembly
‌
US Patent 7378746 Composite bump
‌
US Patent 7378747 Semiconductor device chip and semiconductor device chip package
‌
US Patent 7381636 Planar bond pad design and method of making the same
‌
US Patent 7385278 Strobe light control circuit and IGBT device
‌
US Patent 7388287 Semiconductor package
‌
US Patent 7396763 Semiconductor package using flexible film and method of manufacturing the same
‌
US Patent 7397114 Semiconductor integrated circuit device and method of manufacturing the same
‌
US Patent 7397136 Multi-chip module and single-chip module for chips and proximity connectors
‌
US Patent 7400033 Package on package design to improve functionality and efficiency
‌
US Patent 7400049 Integrated circuit package system with heat sink
‌
US Patent 7405483 Electronic assembly and circuit board
‌
US Patent 7407896 CMOS-compatible light emitting aperiodic photonic structures
‌
US Patent 7408245 IC package encapsulating a chip under asymmetric single-side leads
‌
US Patent 7408255 Assembly for stacked BGA packages
‌
US Patent 7408256 Integrated circuit chip module
‌
US Patent 7408257 Packaging chip and packaging method thereof
‌
US Patent 7408258 Interconnection circuit and electronic module utilizing same
‌
US Patent 7408263 Anisotropic conductive coatings and electronic devices
‌
US Patent 7410830 Leadless plastic chip carrier and method of fabricating same
‌
US Patent 7411278 Package device with electromagnetic interference shield
‌
US Patent 7411292 Flash memory card
‌
US Patent 7411293 Flash memory card
‌
US Patent 7413926 Methods of making microelectronic packages
‌
US Patent 7414300 Molded semiconductor package
‌
US Patent 7414310 Waferscale package system
‌
US Patent 7417329 System-in-package structure
‌
US Patent 7419841 Microelectronic imagers and methods of packaging microelectronic imagers
‌
US Patent 7420206 Interposer, semiconductor chip mounted sub-board, and semiconductor package
‌
US Patent 7420268 Semiconductor chip package and application device thereof
‌
US Patent 7420282 Connection structure for connecting semiconductor element and wiring board, and semiconductor device
‌
US Patent 7423348 Chip structure and chip package structure
‌
US Patent 7423349 Semiconductor device
‌
US Patent 7425503 Apparatus and method for enhanced thermal conductivity packages for high powered semiconductor devices
‌
US Patent 7429790 Semiconductor structure and method of manufacture
‌
US Patent 7432202 Method of substrate manufacture that decreases the package resistance
‌
US Patent 7432582 Method of forming a through-substrate interconnect
‌
US Patent 7432589 Semiconductor device
‌
US Patent 7432602 Semiconductor device
‌
US Patent 7436048 Multichip leadframe package
‌
US Patent 7439100 Encapsulated chip scale package having flip-chip on lead frame structure and method
‌
US Patent 7442963 Light emitting apparatus and method for manufacturing the same
‌
US Patent 7443022 Board-on-chip packages
‌
US Patent 7443026 IC chip package having force-adjustable member between stiffener and printed circuit board
‌
US Patent 7445969 Method of manufacturing a semiconductor device
‌
US Patent 7446391 Electro-resistance element and method of manufacturing the same
‌
US Patent 7446411 Semiconductor structure and method of assembly
‌
US Patent 7449780 Apparatus to minimize thermal impedance using copper on die backside
‌
US Patent 7459796 BGA-type multilayer circuit wiring board
‌
US Patent 7462567 Method for manufacturing integrated circuit
‌
US Patent 7462870 Molded package and semiconductor device using molded package
‌
US Patent 7473569 Manufacturing method for three-dimensional structural body
‌
US Patent 7474007 Semiconductor package
‌
US Patent 7476570 System and method of attaching an integrated circuit assembly to a printed wiring board
‌
US Patent 7482276 Semiconductor device and method of manufacturing the same
‌
US Patent 7482666 Apparatus and method for optical isolation
‌
US Patent 7482701 Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device
‌
US Patent 7485494 Dicing die adhesive film for semiconductor
‌
US Patent 7485496 Semiconductor device package with a heat sink and method for fabricating the same
‌
US Patent 7485949 Semiconductor device
‌
US Patent 7485958 Device with beam structure, and semiconductor device
‌
US Patent 7485971 Electronic device package
‌
US Patent 7485972 Semiconductor device
‌
US Patent 7488996 Thin film transistor array panel for a liquid crystal display
‌
US Patent 7489030 Stacked semiconductor device
‌
US Patent 7495330 Substrate connector for integrated circuit devices
‌
US Patent 7495345 Semiconductor device-composing substrate and semiconductor device
‌
US Patent 7498663 Semiconductor integrated circuit
‌
US Patent 7498668 Stacked semiconductor device and lower module of stacked semiconductor device
‌
US Patent 7504726 Chip and manufacturing method and application thereof
‌
US Patent 7510895 Inferential temperature control system
‌
US Patent 7525188 Multilayer circuit board and production method for same
‌
US Patent 7528422 Package for a light emitting element with integrated electrostatic discharge protection
‌
US Patent 7535083 Lead frame for surface mount-type piezoelectric vibrator
‌
US Patent 7535097 Semiconductor device and method of manufacturing the same
‌
US Patent 7541681 Interconnection structure, electronic component and method of manufacturing the same
‌
US Patent 7544541 Semiconductor package
‌
US Patent 7554182 Semiconductor device and package, and method of manufacturer therefor
‌
US Patent 7554195 Engine with cable direct to outboard memory
‌
US Patent 7563646 Molded ceramic surface mount package
‌
US Patent 7564126 Integrated circuit package
‌
US Patent 7564140 Semiconductor package and substrate structure thereof
‌
US Patent 7564141 Apparatus and method for preventing configurable system-on-a-chip integrated circuits from becoming I/O limited
‌
US Patent 7566647 Method of disposing and arranging dummy patterns
‌
US Patent 7566944 Package structure for optoelectronic device and fabrication method thereof
‌
US Patent 7566961 Multi-stacked package and method of manufacturing the same
‌
US Patent 7566965 Semiconductor module
‌
US Patent 7569473 Methods of forming semiconductor assemblies
‌
US Patent 7569918 Semiconductor package-on-package system including integrated passive components
‌
US Patent 7569921 Semiconductor device and manufacturing method thereof
‌
US Patent 7572738 Crack stop trenches in multi-layered low-k semiconductor devices
‌
US Patent 7573100 High voltage semiconductor device and method for fabricating the same
‌
US Patent 7573138 Stress decoupling structures for flip-chip assembly
‌
US Patent 7573140 Semiconductor device and method for manufacturing the same
‌
US Patent 7576427 Cold weld hermetic MEMS package and method of manufacture
‌
US Patent 7576436 Structure of wafer level package with area bump
‌
US Patent 7576438 Printed circuit board and method thereof and a solder ball land and method thereof
‌
US Patent 7582957 Integrated circuit package system with encapsulation lock
‌
US Patent 7582961 Package structure with circuits directly connected to semiconductor chip
‌
US Patent 7586183 Multilevel semiconductor module and method for fabricating the same
‌
US Patent 7589362 Configurable non-volatile logic structure for characterizing an integrated circuit device
‌
US Patent 7589399 Semiconductor device, lead frame used in the semiconductor device and electronic equipment using the semiconductor device
‌
US Patent 7589406 Stacked semiconductor component
‌
US Patent 7589408 Stackable semiconductor package
‌
US Patent 7592656 Semiconductor device and fabricating method of the same
‌
US Patent 7592708 Package board, semiconductor package, and fabricating method thereof
‌
US Patent 7592709 Board on chip package and method of manufacturing the same
‌
US Patent 7598611 Semiconductor device with side terminals
‌
US Patent 7605460 Method and apparatus for a power distribution system
‌
US Patent 7608533 Semiconductor die attachment for high vacuum tubes
‌
US Patent 7612459 Multi-chip module and single-chip module for chips and proximity connectors
‌
US Patent 7619318 No-flow underfill composition and method
‌
US Patent 7622798 Integrated circuit devices with stacked package interposers
‌
US Patent 7622809 Display device and sputtering target for producing the same
‌
US Patent 7622812 Semiconductor module
‌
US Patent 7629679 Semiconductor package, memory card including the same, and mold for fabricating the memory card
‌
US Patent 7633140 Inverted J-lead for power devices
‌
US Patent 7633143 Semiconductor package having plural chips side by side arranged on a leadframe
‌
US Patent 7633166 Terminal connection structure for semiconductor device
‌
US Patent 7638881 Chip package
‌
US Patent 7638888 Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method
‌
US Patent 7642640 Semiconductor device and manufacturing process thereof
‌
US Patent 7652356 Tape carrier, tape carrier for liquid crystal display device, and liquid crystal display device
‌
US Patent 7652371 Semiconductor package
‌
US Patent 7652382 Micro chip-scale-package system
‌
US Patent 7655501 Wafer level package with good CTE performance
‌
US Patent 7656007 Package substrate with inserted discrete capacitors
‌
US Patent 7656043 Semiconductor package and method for manufacturing the same
‌
US Patent 7656048 Encapsulated chip scale package having flip-chip on lead frame structure
‌
US Patent 7659205 Amorphous carbon-based non-volatile memory
‌
US Patent 7659610 Flash memory card
‌
US Patent 7659633 Solder joint flip chip interconnection having relief structure
‌
US Patent 7663206 Interposer including at least one passive element at least partially defined by a recess formed therein, system including same, and wafer-scale interposer
‌
US Patent 7663226 Heat-releasing printed circuit board and semiconductor chip package
‌
US Patent 7663250 Wafer level package and manufacturing method thereof
‌
US Patent 7663254 Semiconductor apparatus and method of manufacturing the same
‌
US Patent 7667305 Semiconductor device
‌
US Patent 7667306 Leadframe-based semiconductor package
‌
US Patent 7667313 Stacked semiconductor module
‌
US Patent 7667320 Integrated circuit package with improved power signal connection
‌
US Patent 7667331 Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip
‌
US Patent 7667338 Package with solder-filled via holes in molding layers
‌
US Patent 7679201 Device package
‌
US Patent 7687898 Stacked semiconductor package
‌
US Patent 7692216 Thin film transistor array panel for a liquid crystal display
‌
US Patent 7705404 Electrostatic discharge protection device and layout thereof
‌
US Patent 7705437 Semiconductor device
‌
US Patent 7709846 Light emitting apparatus and method for manufacturing the same
‌
US Patent 7709938 Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
‌
US Patent 7709953 Semiconductor device
‌
US Patent 7709957 Semiconductor device
‌
US Patent 7714425 Semiconductor device, method for manufacturing the same, and flexible substrate for mounting semiconductor
‌
US Patent 7714434 Semiconductor apparatus with decoupling capacitor
‌
US Patent 7714454 Chip module and method for producing a chip module
‌
US Patent 7714455 Semiconductor packages and methods of fabricating the same
‌
US Patent 7719003 Active organic semiconductor devices and methods for making the same
‌
US Patent 7719095 Lead frame and semiconductor device provided with lead frame
‌
US Patent 7723835 Semiconductor device package structure
‌
US Patent 7732908 Semiconductor device and semiconductor memory device
‌
US Patent 7732916 Semiconductor package
‌
US Patent 7732919 Semiconductor device
‌
US Patent 7737565 Stackable semiconductor package and method for its fabrication
‌
US Patent 7746661 Printed circuit board with coextensive electrical connectors and contact pad areas
‌
US Patent 7759753 Integrated circuit die, integrated circuit package, and packaging method
‌
US Patent 7763962 Wafer-level packaging of micro devices
‌
US Patent 7763971 Circuit module and electrical component
‌
US Patent 7772083 Trench forming method and structure
‌
US Patent 7772693 Panel, semiconductor device and method for the production thereof
‌
US Patent 7777308 Integrated circuit packages including sinuous lead frames
‌
US Patent 7786593 Integrated circuit die with pedestal
‌
US Patent 7791179 Integrated battery pack with lead frame connection
‌
US Patent 7791211 Flip chip package structure and carrier thereof
‌
US Patent 7795719 Electro component package
‌
US Patent 7795720 Inversely alternate stacked structure of integrated circuit modules
‌
US Patent 7795736 Interconnects with interlocks
‌
US Patent 7800230 Solder preform and electronic component
‌
US Patent 7808094 Stacked structure of semiconductor chips, memory card, and method of manufacturing stacked structure of semiconductor chips
‌
US Patent 7811864 Method of fabricating semiconductor package
‌
US Patent 7812440 Electronic package device, module, and electronic apparatus
‌
US Patent 7812460 Packaging substrate and method for fabricating the same
‌
US Patent 7816779 Multimode signaling on decoupled input/output and power channels
‌
US Patent 7816784 Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same
‌
US Patent 7816785 Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
‌
US Patent 7821118 Power distribution pattern for a ball grid array
‌
US Patent 7825496 Semiconductor device having a filling pattern around a storage structure and method of forming the same
‌
US Patent 7825509 Transducer package with transducer die unsupported by a substrate
‌
US Patent 7825526 Fine-pitch routing in a lead frame based system-in-package (SIP) device
‌
US Patent 7830003 Mechanical isolation for MEMS devices
‌
US Patent 7842541 Ultra thin package and fabrication method
‌
US Patent 7846773 Multi-chip semiconductor package
‌
US Patent 7855445 Circuit device including rotated stacked die
‌
US Patent 7855446 Semiconductor memory device and semiconductor memory card
‌
US Patent 7855447 Semiconductor integrated circuit device, PDP driver, and plasma display panel
‌
US Patent 7859094 Integrated circuit package system for stackable devices
‌
US Patent 7859123 Wire bonding structure and manufacturing method thereof
‌
US Patent 7863095 Method of manufacturing layered chip package
‌
US Patent 7863725 Power device packages and methods of fabricating the same
‌
US Patent 7863747 Semiconductor chip, method of fabricating the same and semiconductor chip stack package
‌
US Patent 7867906 Semiconductor device and method for manufacturing same
‌
US Patent 7868383 Configurable non-volatile logic structure for characterizing an integrated circuit device
‌
US Patent 7868442 Layered chip package and method of manufacturing same
‌
US Patent 7875988 Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same
‌
US Patent 7880317 Semiconductor device and method of manufacturing semiconductor device
‌
US Patent 7884451 Packaging for high speed integrated circuits
‌
US Patent 7884460 Integrated circuit packaging system with carrier and method of manufacture thereof
‌
US Patent 7884470 Semiconductor packages with stiffening support for power delivery
‌
US Patent 7884474 Method for fabricating semiconductor device and semiconductor device
‌
US Patent 7888785 Semiconductor package embedded in substrate, system including the same and associated methods
‌
US Patent 7888790 Bare die package with displacement constraint
‌
US Patent 7888809 Semiconductor device and method of manufacturing the same
‌
US Patent 7898077 Adjustable threaded cores for LED thermal management
‌
US Patent 7902664 Semiconductor package having passive component and semiconductor memory module including the same
‌
US Patent 7902677 Composite layered chip package and method of manufacturing same
‌
US Patent 7910406 Electronic circuit device and method for manufacturing same
‌
US Patent 7911070 Integrated circuit packaging system having planar interconnect
‌
US Patent 7915173 Shallow trench isolation structure having reduced dislocation density
‌
US Patent 7923832 Integrated circuit package
‌
US Patent 7928538 Package-level electromagnetic interference shielding
‌
US Patent 7928541 Copper alloy sheet and QFN package
‌
US Patent 7928588 Circuit signal connection interface, a manufacture method thereof, and an electronic device using the same
‌
US Patent 7932585 Electrical component and film composite laminated on the component and method for production
‌
US Patent 7932617 Semiconductor package and manufacturing method thereof and encapsulating method thereof
‌
US Patent 7939370 Power semiconductor package
‌
US Patent 7939835 Light emitting apparatus and method for manufacturing the same
‌
US Patent 7939926 Via first plus via last technique for IC interconnects
‌
US Patent 7939951 Mounting substrate and electronic apparatus
‌
US Patent 7943436 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices
‌
US Patent 7944037 Semiconductor device and semiconductor memory device
‌
US Patent 7944043 Semiconductor device having improved contact interface reliability and method therefor
‌
US Patent 7944056 Hillock-free aluminum layer and method of forming the same
‌
US Patent 7944062 Air cavity package for a semiconductor die and methods of forming the air cavity package
‌
US Patent 7956475 Step cavity for enhanced drop test performance in ball grid array package
‌
US Patent 7964957 Circuit substrate, circuit device and manufacturing process thereof
‌
US Patent 7968990 Semiconductor device and method of fabricating the same
‌
US Patent 7968993 Stacked semiconductor device and semiconductor memory device
‌
US Patent 7973323 Semiconductor device and manufacturing method thereof, and camera module including the same
‌
US Patent 7973404 Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device
‌
US Patent 7982321 Apparatus and method for preventing configurable system-on-a-chip integrated circuits from beginning I/O limited
‌
US Patent 7986038 Electronic device and lid
‌
US Patent 7989943 Staircase shaped stacked semiconductor package
‌
US Patent 7989946 Multimode signaling on decoupled input/output and power channels
‌
US Patent 7989955 Semiconductor device, electronic device, and method of producing semiconductor device
‌
US Patent 7994635 Power semiconductor module
‌
US Patent 7994645 Integrated circuit package system with wire-in-film isolation barrier
‌
US Patent 7998870 Semiconductor device and method for forming using the same
‌
US Patent 7999385 Semiconductor device
‌
US Patent 8004079 Chip package structure and manufacturing method thereof
‌
US Patent 8004093 Integrated circuit package stacking system
‌
US Patent 8008766 Stacked semiconductor module
‌
US Patent 8008785 Microelectronic assembly with joined bond elements having lowered inductance
‌
US Patent 8012874 Semiconductor chip substrate with multi-capacitor footprint
Edits on 13 Dec, 2021
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Golden AI
edited on 13 Dec, 2021
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Patent primary examiner of
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US Patent 8012874 Semiconductor chip substrate with multi-capacitor footprint
Edits on 8 Dec, 2021
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Golden AI
edited on 8 Dec, 2021
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Patent primary examiner of
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US Patent 8008766 Stacked semiconductor module
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Golden AI
edited on 8 Dec, 2021
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Patent primary examiner of
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US Patent 8008785 Microelectronic assembly with joined bond elements having lowered inductance
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Golden AI
edited on 8 Dec, 2021
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Patent primary examiner of
‌
US Patent 8004093 Integrated circuit package stacking system
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Golden AI
edited on 8 Dec, 2021
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Patent primary examiner of
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US Patent 8004079 Chip package structure and manufacturing method thereof
Edits on 8 Dec, 2021
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Golden AI
edited on 8 Dec, 2021
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Patent primary examiner of
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US Patent 7999385 Semiconductor device
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Golden AI
edited on 8 Dec, 2021
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Patent primary examiner of
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US Patent 7998870 Semiconductor device and method for forming using the same
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Golden AI
edited on 8 Dec, 2021
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Patent primary examiner of
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US Patent 7994645 Integrated circuit package system with wire-in-film isolation barrier
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Golden AI
edited on 8 Dec, 2021
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Patent primary examiner of
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US Patent 7994635 Power semiconductor module
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Golden AI
edited on 8 Dec, 2021
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Patent primary examiner of
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US Patent 7989955 Semiconductor device, electronic device, and method of producing semiconductor device
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Golden AI
edited on 8 Dec, 2021
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US Patent 7989946 Multimode signaling on decoupled input/output and power channels
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US Patent 7989943 Staircase shaped stacked semiconductor package
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US Patent 7986038 Electronic device and lid
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US Patent 7968990 Semiconductor device and method of fabricating the same
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US Patent 7968993 Stacked semiconductor device and semiconductor memory device

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